Publications

2024

• Trusted Computing Architectures for IoT DevicesBraeken, A., da Silva, B., Segers, L., Knödtel, J., Reichenbach, M., Wulf, C., Pertuz Mendez, S. A. & 4 others, 2024, Applied Reconfigurable Computing. Architectures, Tools, and Applications - 20th International Symposium, ARC 2024, Proceedings: 20th International Symposium, ARC 2024 Aveiro, Portugal, March 20–22, 2024 Proceedings. Skliarova, I., Jiménez, P. B., Véstias, M. & Diniz, P. C. (eds.). Springer, Cham, p. 241-254, 13 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• TSN over 5G: Overcoming Challenges and Realizing IntegrationWelte, D., Lehmann, C., Schappacher, M., Hoschele, T., Sikora, A. & Fitzek, F. H., 2024, 2024 IEEE 20th International Conference on Factory Communication Systems, WFCS 2024. Mifdaoui, A., Almeida, L., Golatowski, F., Scanzio, S., Santos, P. & Danielis, P. (eds.). Institute of Electrical and Electronics Engineers (IEEE), p. 1-8, 8 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Understanding the impact of the dielectric layer in modulating the TER of FTJ devicesCarpentieri, L., Namlab, S. L., Mikolajick, T. & Slesazeck, S., 2024, ESSERC 2024 - Proceedings: 50th IEEE European Solid-State Electronics Research Conference. IEEE Computer Society, p. 408-411, 4 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Understanding the Substrate Effect on De-embedding Structures Fabricated on SOI Wafers Using Electromagnetic SimulationWesling, B. N., Deng, M., Mukherjee, C., Mikolajick, T., Trommer, J. & Maneux, C., 2024, 2024 IEEE 36th International Conference on Microelectronic Test Structures, ICMTS 2024 - Proceedings. Institute of Electrical and Electronics Engineers (IEEE)Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Unification in ELH_R+ without the Top Concept modulo Cycle-Restricted Ontologies (Extended Abstract)Baader, F. & Gil, O. F., 2024, Proceedings of the 37th International Workshop on Description Logics (DL'24). Jung, J. C., Giordano, L. & Ozaki, A. (eds.). Bergen, Norway: CEUR-WS.org, 5 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Unjammable: A Practical Approach to Jamming-Safe Wireless ChannelsKurt, M. A., Sheshagiri, P. K. H., Gabriel, J., Cabrera, J. A., Xiao, X. & Fitzek, F. H., 2024, GLOBECOM 2024 - 2024 IEEE Global Communications Conference. Institute of Electrical and Electronics Engineers (IEEE), p. 1010-1014, 5 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Unlocking Opportunities: Empowering Autistic Adults in Vocational Training and Employment Through Assistive TechnologiesGollasch, D., Engel, C., Branig, M., Schmalfuß-Schwarz, J. & Weber, G., 2024, Universal Access in Human-Computer Interaction - 18th International Conference, UAHCI 2024, Held as Part of the 26th HCI International Conference, HCII 2024, Proceedings: 18th International Conference, UAHCI 2024, Held as Part of the 26th HCI International Conference, HCII 2024, Washington, DC, USA, June 29 – July 4, 2024, Proceedings. Antona, M. & Stephanidis, C. (eds.).p. 32–46, 15 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Untersuchung der Öl-Kältemittel Interaktionen in Wärmepumpen: Vom Fluid bis zur AnlageStöckel, K., Rudzik, T., Halle, A., Xu, Y., Vering, C., Venzik, V. & Thomas, C., 2024Research output: Contribution to conferences > Presentation slides
• Untersuchung der räumlichen Wirkmechanismen beim Rillen von Wellpappe mit Hilfe von Simulationswerkzeugen auf der Basis der Finite-Elemente- Methode (FEM)Douglas, R., 2024, In: Wochenblatt für Papierfabrikation. 152, 1, p. 84, 1 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Untersuchung eines örtlichen Messkonzepts zur Beschreibung des Ermüdungsverhaltens gewebeverstärkter Faser-Kunststoff-VerbundeWolf, C. H., Henkel, S., Düreth, C., Gude, M. & Biermann, H., 2024, Bruchmechanische Werkstoff- und Bauteilbewertung - Beanspruchungsanalyse, Prüfmethoden und Anwendungen: 56. Tagung des DVM-Arbeitskreises Bruchmechanik und Bauteilsicherheit. Vormwald, M. (ed.). Deutscher Verband für Materialforschung und -prüfung e.V., p. 189-200, 12 p., 361Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution