2023

• Sneak-Path Effect on Chimera states of Memristor-coupled Chua Circuit NetworksTsakalos, K. A., Ntinas, V., Dimitrakis, P., Provata, A. & Sirakoulis, G. C., 2023, ISCAS 2023 - 56th IEEE International Symposium on Circuits and Systems, Proceedings. Institute of Electrical and Electronics Engineers Inc.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Softwarization in Satellite and Interplanetary NetworksArzo, S. T., Bassoli, R., Devetsikiotis, M., Granelli, F. & Fitzek, F. H., 2023, A Roadmap to Future Space Connectivity : Satellite and Interplanetary Networks. Sacchi, C., Granelli, F., Bassoli, R., Fitzek, F. H. P. & Ruggieri, M. (eds.). Springer Science and Business Media B.V., p. 203-226, 24 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Chapter in book/Anthology/Report
• Spatiotemporal Organization of Touch Information in Tactile Neuron Population ResponsesTummala, N., Shao, Y. & Visell, Y., 2023, 2023 IEEE World Haptics Conference, WHC 2023 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 183-189, 7 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Special Session: Mitigating Side-Channel Attacks Through Circuit to Application Layer ApproachesKavand, N., Darjani, A., Trommer, J., Galderisi, G., Mikolajick, T., Muller, N., Moradi, A. & 8 others, 2023, Proceedings - 2023 International Conference on Hardware/Software Codesign and System Synthesis, CODES+ISSS 2023. Institute of Electrical and Electronics Engineers Inc., p. 8-17, 10 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Spectral Efficiency Analysis for a Spike-Based Pulse Repetition Frequency Modulation SchemeRoth, F., Dorpinghaus, M. & Fettweis, G., 2023, 2023 IEEE 3rd International Symposium on Joint Communications and Sensing, JC and S 2023. Institute of Electrical and Electronics Engineers Inc., p. 1-6Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• SpiNNaker2: A Large-Scale Neuromorphic System for Event-Based and Asynchronous Machine LearningGonzalez, H. A., Huang, J., Kelber, F., Nazeer, K. K., Langer, T. H., Liu, C., Lohrmann, M. A. & 7 others, 2023, First Workshop on Machine Learning with New Compute Paradigms. 10 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Split CFD-simulation approach for effective quantification of mixed convective heat transfer coefficients on complex machine tool modelsKumar, T. S., Geist, A., Naumann, C., Glänzel, J. & Ihlenfeldt, S., 2023, In: Procedia CIRP. 118, p. 199-204, 6 p.Electronic (full-text) versionResearch output: Contribution to journal > Conference article
• Stacked multi-layer capacitive strain sensor based on dielectric elastomersProkopchuk, A., Ewert, A., Menning, J., Richter, A., Schlecht, B., Wallmersperger, T. & Henke, E. M., 2023, 10th ECCOMAS Thematic Conference on Smart Structures and Materials. p. 1657-1668, 12 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• STAMP-Rust: Language and Performance Comparison to C on Transactional BenchmarksSuchert, F. & Castrillon, J., 2023, Benchmarking, Measuring, and Optimizing - 14th Bench Council International Symposium, Bench 2022, Revised Selected Papers. Gainaru, A., Zhang, C. & Luo, C. (eds.). Springer Science and Business Media B.V., p. 160-175, 16 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Standards for Information Models Considering Knowledge Distribution in Modular PlantsKoch, A., Hamedi, N., Furtner, L., Kock, T., Klose, A. & Madler, J., 2023, 2023 IEEE 21st International Conference on Industrial Informatics, INDIN 2023. Dorksen, H., Scanzio, S., Jasperneite, J., Wisniewski, L., Man, K. F., Sauter, T., Seno, L., Trsek, H. & Vyatkin, V. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 1-7Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution