2023

• Smart machine elements – sensor-integrating elastomer couplingsEwert, A., Menning, J., Prokopchuk, A., Rosenlöcher, T., Henke, E. M., Wallmersperger, T. & Schlecht, B., 2023, Proceedings of the 10th International Conference on Smart Structures and Materials. p. 1681-1690, 10 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Smart Pressure Film Sensor for Machine Tool Optimization and Characterization of the Dynamic Pressure Field on Machine SurfacesErben, A., Geist, A., Voigt, I., Senf, B., Mäder, T., Glänzel, J., Ihlenfeldt, S. & 1 others, 2023, Lecture Notes in Production Engineering. Springer Nature, p. 179-191, 13 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Chapter in book/Anthology/Report
• Sneak-Path Effect on Chimera states of Memristor-coupled Chua Circuit NetworksTsakalos, K. A., Ntinas, V., Dimitrakis, P., Provata, A. & Sirakoulis, G. C., 2023, ISCAS 2023 - 56th IEEE International Symposium on Circuits and Systems, Proceedings. Institute of Electrical and Electronics Engineers Inc.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Softwarization in Satellite and Interplanetary NetworksArzo, S. T., Bassoli, R., Devetsikiotis, M., Granelli, F. & Fitzek, F. H., 2023, A Roadmap to Future Space Connectivity : Satellite and Interplanetary Networks. Sacchi, C., Granelli, F., Bassoli, R., Fitzek, F. H. P. & Ruggieri, M. (eds.). Springer Science and Business Media B.V., p. 203-226, 24 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Chapter in book/Anthology/Report
• Spatiotemporal Organization of Touch Information in Tactile Neuron Population ResponsesTummala, N., Shao, Y. & Visell, Y., 2023, 2023 IEEE World Haptics Conference, WHC 2023 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 183-189, 7 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Special Session: Mitigating Side-Channel Attacks Through Circuit to Application Layer ApproachesKavand, N., Darjani, A., Trommer, J., Galderisi, G., Mikolajick, T., Muller, N., Moradi, A. & 8 others, 2023, Proceedings - 2023 International Conference on Hardware/Software Codesign and System Synthesis, CODES+ISSS 2023. Institute of Electrical and Electronics Engineers Inc., p. 8-17, 10 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Spectral Efficiency Analysis for a Spike-Based Pulse Repetition Frequency Modulation SchemeRoth, F., Dorpinghaus, M. & Fettweis, G., 2023, 2023 IEEE 3rd International Symposium on Joint Communications and Sensing, JC and S 2023. Institute of Electrical and Electronics Engineers Inc., p. 1-6Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• SpiNNaker2: A Large-Scale Neuromorphic System for Event-Based and Asynchronous Machine LearningGonzalez, H. A., Huang, J., Kelber, F., Nazeer, K. K., Langer, T. H., Liu, C., Lohrmann, M. A. & 7 others, 2023, First Workshop on Machine Learning with New Compute Paradigms. 10 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Split CFD-simulation approach for effective quantification of mixed convective heat transfer coefficients on complex machine tool modelsKumar, T. S., Geist, A., Naumann, C., Glänzel, J. & Ihlenfeldt, S., 2023, In: Procedia CIRP. 118, p. 199-204, 6 p.Electronic (full-text) versionResearch output: Contribution to journal > Conference article
• Stacked multi-layer capacitive strain sensor based on dielectric elastomersProkopchuk, A., Ewert, A., Menning, J., Richter, A., Schlecht, B., Wallmersperger, T. & Henke, E. M., 2023, 10th ECCOMAS Thematic Conference on Smart Structures and Materials. p. 1657-1668, 12 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution