2023

• Integration of Digitization and Sustainability Objectives in a Maturity Model-Based Strategy Development ProcessMünnich, M., Stange, M., Süße, M. & Ihlenfeldt, S., 2023, Manufacturing Driving Circular Economy - Proceedings of the 18th Global Conference on Sustainable Manufacturing. Kohl, H., Seliger, G. & Dietrich, F. (eds.). Springer Science and Business Media B.V., p. 918-926, 9 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Intelligent Scheduling in Softwarized 3D Networks for Industrial IoT ApplicationsZhang, J., Nguyen, G. & Fitzek, F. H., 2023, 2023 IEEE Conference on Network Function Virtualization and Software Defined Networks, NFV-SDN 2023 - Proceedings. Fitzek, F. H., Horner, L., Gharbaoui, M., Nguyen, G., Gu, R. & Meuser, T. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 185-188, 4 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Intermediate wake characteristics behind a circular cylinderVentosa Molina, J., Rodríguez Pérez, I. M., Lehmkuhl Barba, O. & Fröhlich, J., 2023, 14th International ERCOFTAC Symposium on Engineering, Turbulence, Modelling and MeasurementsResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Intermetallic Growth Study of Ultra-Thin Copper and Tin Bilayer for Hybrid Bonding ApplicationsKhurana, G. & Panchenko, I., 2023, 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC). Institute of Electrical and Electronics Engineers Inc., p. 866-871, 6 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Interplay Between Priority Queues and Controlled Delay in Programmable Data PlanesDoan, T. V., Scheinert, T., Lhamo, O., Cabrera, J. A., Fitzek, F. H. & Nguyen, G. T., 2023, 2023 18th Wireless On-Demand Network Systems and Services Conference, WONS 2023. Institute of Electrical and Electronics Engineers Inc., p. 64-71, 8 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Investigating the Impact of Non-Volatile Memories on Energy-Efficiency of Coarse-Grained Reconfigurable ArchitecturesAliagha, E., Iskandar, V., Enseleit, S. & Gohringer, D., 2023, Proceedings - 2023 26th Euromicro Conference on Digital System Design, DSD 2023. Niar, S., Ouarnoughi, H. & Skavhaug, A. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 748-755, 8 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Investigation of a Heat Pump Dishwasher with Natural Refrigerant MixtureStöckel, K., Mickoleit, E., Busching, F., Barta, R. B. & Thomas, C., 2023Research output: Contribution to conferences > Paper
• Investigation of a novel CO₂ ultrahigh-lift ejector cycle with an additional subcooling heat exchangerHerden, D., Doerffel, C., Barta, R. B. & Thomas, C., 2023, 11 p.Electronic (full-text) versionResearch output: Contribution to conferences > Paper
• Investigation of Complex Electrical Properties of Concrete during Decommissioning of Nuclear Power Plants: An Experimental AnalysisNurjahan, T., Schleicher, E., Hampel, U. & De Assis Dias, F., 2023, Proceedings of International Workshop on Impedance Spectroscopy, IWIS 2023. Institute of Electrical and Electronics Engineers Inc., p. 56-60, 5 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Investigation of Recovery Phenomena in Hf0.5Zr0.5O2-based 1T1C FeRAMOkuno, J., Yonai, T., Kunihiro, T., Shuto, Y., Alcala, R., Lederer, M., Seidel, K. & 4 others, 2023, In: IEEE journal of the Electron Devices Society. 11, p. 43-46, 4 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article