Publications
The Research Portal (FIS) of TU Dresden provides a detailed search for publications in the School of Engineering Sciences.
20058 Entries
2023
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Molecular engineering of naphthalene spacers in low-dimensional perovskites, 21 Apr 2023, In: Journal of Materials Chemistry C. 11, 15, p. 5024-5031, 8 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
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Chemical hydrogel sensors based on the bimorph effect with short response time, 20 Apr 2023, In: Journal of sensors and sensor systems. 12 (2023), 1, p. 141-146, 6 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
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Comparison of Recorded and Synthesized Stimuli of Traffic Scenarios in an Auditory Virtual Reality Environment Using Wave Field Synthesis, 19 Apr 2023, DAGA 2023 - 49th German Annual Conference on Acoustics. p. 1447-1450Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Demonstrating CleAR Sight: Transparent Interaction Panels for Augmented Reality, 19 Apr 2023, CHI 2023 - Extended Abstracts of the 2023 CHI Conference on Human Factors in Computing Systems. Schmidt, A., Väänänen, K., Goyal, T., Kristensson, P. O. & Peters, A. (eds.). Association for Computing Machinery, 5 p., 432Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Enhancing thermoelectric performance via relaxed spin polarization upon magnetic impurity doping, 19 Apr 2023, In: Journal of Materials Chemistry A. 11, 23, p. 12013-12024, 12 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
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Experimental and numerical study on the transport of dilute bubbles in a T-junction channel flow, 19 Apr 2023, In: Experimental and Computational Multiphase Flow. 5, 4, p. 396-410, 15 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
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Finite Element Model for Prediction of Back-End-of-Line Process Induced Wafer Bow for Patterned Wafer, 19 Apr 2023, 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Institute of Electrical and Electronics Engineers (IEEE), p. 1-10, 10 p., 10100826Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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PEARL: Physical Environment based Augmented Reality Lenses for In-Situ Human Movement Analysis, 19 Apr 2023, CHI '23: Proceedings of the 2023 CHI Conference on Human Factors in Computing SystemsElectronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Point Cloud Alignment through Mid-Air Gestures on a Stereoscopic Display, 19 Apr 2023, CHI 2023 - Extended Abstracts of the 2023 CHI Conference on Human Factors in Computing Systems. New York, NY, USA: Association for Computing Machinery (ACM), New York, p. 230:1-230:7Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Spatiality and Semantics - Towards Understanding Content Placement in Mixed Reality, 19 Apr 2023, CHI 2023 - Extended Abstracts of the 2023 CHI Conference on Human Factors in Computing Systems. New York, NY, USA: Association for Computing Machinery (ACM), New York, p. 254:1-254:8Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution