Publications

2023

• Improvement in Wafer-to-Wafer Hybrid Bonding Using Optimized Chemical Mechanical Planarization Process for Cu DishingKhurana, G. & Panchenko, I., 8 Dec 2023, 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC). Tay, A., Chui, K. J., Lim, Y. K., Tan, C. S. & Shin, S. (eds.). Institute of Electrical and Electronics Engineers (IEEE), p. 373-380, 8 p., 10457774Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Study on Using Noisy Synthetic Data for Neural Networks to Assess Thermo-Mechanical Reliability Parameters of Solder InterconnectsAlbrecht, O., Höhne, R. D. J., Barkur, D., Meier, K. & Bock, K., 8 Dec 2023, Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023. Tay, A., Chui, K. J., Lim, Y. K., Tan, C. S. & Shin, S. (eds.). Institute of Electrical and Electronics Engineers (IEEE), p. 751-756, 6 p., 10457730Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Temperature-dependent Creep Characterization of Lead-free Solder Alloys Using Nanoindentation for Finite Element ModelingDudash, V., Machani, K. V., Meier, K., Geisler, H., Mueller, M., Kuechenmeister, F., Wieland, M. & 1 others, 8 Dec 2023, Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023. Tay, A., Chui, K. J., Lim, Y. K., Tan, C. S. & Shin, S. (eds.). Institute of Electrical and Electronics Engineers (IEEE), p. 757-763, 7 p., 10457727Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Feature causalityDubslaff, C., Weis, K., Baier, C. & Apel, S., 7 Dec 2023, In: Journal of Systems and Software. 209 (2024), 19 p., 111915Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Tailoring of thermomagnetic properties in Ni-Mn-Ga films through Cu additionFink, L., Nielsch, K. & Fähler, S., 5 Dec 2023, In: Journal of alloys and compounds. 966, 171435Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Uncertainty analysis of gamma-ray densitometry applied for gas flow modulation technique in bubble columnsMarchini, S., Bieberle, A., Schubert, M. & Hampel, U., 5 Dec 2023, In: Chemical engineering science. 282, 119214Electronic (full-text) versionResearch output: Contribution to journal > Research article
• A Last-Level Defense for Application Integrity and ConfidentialityPereira Fernandez, G., Brito, A., Hartono, A. P. P., Sardar, M. U. & Fetzer, C., 4 Dec 2023, 10 p.Electronic (full-text) versionResearch output: Contribution to conferences > Paper
• Digital Twin of the Radio Environment: A Novel Approach for Anomaly Detection in Wireless NetworksKrause, A., Khursheed, M. D., Schulz, P., Burmeister, F. & Fettweis, G., 4 Dec 2023, 2023 IEEE Globecom Workshops (GC Wkshps). p. 1307-1312, 6 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Discussing Facets of Hybrid User Interfaces for the Medical DomainKrug, K., Langner, R. & Klamka, K., 4 Dec 2023, 2023 IEEE International Symposium on Mixed and Augmented Reality Adjunct (ISMAR-Adjunct). Bruder, G., Olivier, A., Cunningham, A., Peng, E. Y., Grubert, J. & Williams, I. (eds.). Institute of Electrical and Electronics Engineers (IEEE), p. 257-260, 4 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Modeling of a Nonvolatile Organic Memory Device with Memcapacitve PropertiesPetrauskas, L. N., Kumari, R. A., Boroujeni, B. K., Mannsfeld, S. C. B. & Ellinger, F., 4 Dec 2023, 2023 30th IEEE International Conference on Electronics, Circuits and Systems (ICECS). p. 1-4Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution