Publications

2023

• Maturity Evaluation of SDKs for I4.0 Digital TwinsBraunisch, N., Lehmann, R., Wollschlaeger, M., Ristin, M., Venn, H. W. V. D., Otto, B. & Kleinert, T., 15 Sep 2023, 2023 IEEE 28th International Conference on Emerging Technologies and Factory Automation (ETFA). Institute of Electrical and Electronics Engineers (IEEE), p. 1-8, 8 p., 10275719Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• On the relevance of descriptor fidelity in microstructure reconstructionSeibert, P., Raßloff, A., Kalina, K., Safi, A., Reck, P., Peterseim, D., Klusemann, B. & 1 others, 15 Sep 2023, In: Proceedings in Applied Mathematics and Mechanics: PAMM. 23, 3, e202300116Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Portable microfluidic impedance biosensor for SARS-CoV-2 detectionLaleh, S., Ibarlucea, B., Stadtmüller, M., Cuniberti, G. & Medina-Sánchez, M., 15 Sep 2023, In: Biosensors and Bioelectronics. 236, 115362Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Process Control Principles for Scalable Electrolysis SystemsLorenz, J., Klose, A., Lange, H., Kock, T. & Urbas, L., 15 Sep 2023, 2023 IEEE 28th International Conference on Emerging Technologies and Factory Automation (ETFA). Institute of Electrical and Electronics Engineers (IEEE), p. 1-4, 4 p., 10275330Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• The influence of phase morphology of polycarbonate/polyethersulfone blends on the failure behavior between the blends and polyurethane in the peel testSchneider, K., Bräuer, M., Bobeth, M., Kühnert, I., Malanin, M., Schlenstedt, K. & Pompe, W., 15 Sep 2023, In: Journal of applied polymer science. 140, 35, e54349Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Transformation of process functions to the Module Type Package utilizing System Control DiagramsKock, T., Klose, A., Ingebringsten, I. P., Bittorf, L., Lorenz, J. & Urbas, L., 15 Sep 2023, 2023 IEEE 28th International Conference on Emerging Technologies and Factory Automation (ETFA). Institute of Electrical and Electronics Engineers (IEEE), p. 1-4, 4 p., 10275331Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Characterization of Embedded and Thinned RF ChipsYin, R., Morath, H. P. E., Hoyer, C., Nieweglowski, K., Meier, K., Wagner, J., Ellinger, F. & 1 others, 14 Sep 2023, 24th European Microelectronics and Packaging Conference, EMPC 2023. Institute of Electrical and Electronics Engineers (IEEE), p. 1-6, 6 p., 10418325Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Digitalisierungsbezogene Kompetenzen: Sichtweisen von Lehrkräften auf Medien-, Anwendungs- und InformatikkompetenzenSpalteholz, W., Leonhardt, T. & Bergner, N., 14 Sep 2023, HDI 2023 Hochschuldidaktik Informatik: 10. Fachtagung Hochschuldidaktik Informatik (HDI) 2023. Desel, J. & Opel, S. (eds.). FernUniversität in Hagen, p. 9-21, 12 p.Research output: Contribution to book/conference proceedings/anthology/report > Chapter in book/Anthology/Report
• Hybrid Lithography Fabrication of Single Mode Optics for Signal Redistribution and CouplingWeyers, D., Nieweglowski, K. & Bock, K., 14 Sep 2023, 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC). Institute of Electrical and Electronics Engineers (IEEE), p. 1-8, 8 p., 10418392Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Integration of Multi-Lithography Technologies for the Fabrication of Flexible Optical LinkMistry, A., Nieweglowski, K. & Bock, K., 14 Sep 2023, 24th European Microelectronics and Packaging Conference, EMPC 2023. Institute of Electrical and Electronics Engineers (IEEE), p. 1-5, 5 p., 10418428Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution