Publications
The Research Portal (FIS) of TU Dresden provides a detailed search for publications in the School of Engineering Sciences.
18980 Entries
2022
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Optimal Fixed-Premise Repairs of ℰℒ TBoxes (Extended Version) , 19 Sep 2022Electronic (full-text) versionResearch output: Contribution to conferences > Paper
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Selection of a suitable photosynthetically active microalgae strain for the co-cultivation with mammalian cells , 19 Sep 2022, In: Frontiers in bioengineering and biotechnology. 10, 16 p., 994134Electronic (full-text) versionResearch output: Contribution to journal > Research article
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Textile reinforcement structures for concrete construction applications - a review , 19 Sep 2022, In: Journal of Composite Materials. 56, 26, p. 4041-4064, 24 p.Electronic (full-text) versionResearch output: Contribution to journal > Review article
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A user-friendly headset for radar-based silent speech recognition , 18 Sep 2022, Proceedings Interspeech 2022. p. 4835-4839, 5 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Evaluation of different antenna types and positions in a stepped frequency continuous-wave radar-based silent speech interface , 18 Sep 2022, Proceedings Interspeech 2022. p. 3633-3637, 5 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Modular ISRU Systems as a Building Block for Sustainable Space Exploration , 18 Sep 2022, 15 p.Electronic (full-text) versionResearch output: Book/Report/Anthology > Conference proceeding
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Beat-to-Beat Blood Pressure Estimation by Photoplethysmography and Its Interpretation , 17 Sep 2022, In: Sensors. 22, 18, 7037Electronic (full-text) versionResearch output: Contribution to journal > Research article
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Magnetunterstützte Kontaktierung zur Realisierung von zuverlässigen dehnbaren Sensorsystemen , 17 Sep 2022, Proceedings of the Konferenz des Fachverbandes für Design, Leiterplatten- und Elektronikfertigung (FED)Research output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Advances in UV-lithographic patterning of multi-layer waveguide stack for single mode polymeric RDL , 16 Sep 2022, 2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings. IEEE, p. 405-409, 5 p., 9939517Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Characterization of material adhesion in redistribution multilayer for embedded high-frequency packages , 16 Sep 2022, 2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 321-325, 5 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution