Publications

2023

• Poster: A Case for Heterogenous Co-Simulation of Cooperative and Autonomous DrivingHardes, T., Turcanu, I. & Sommer, C., Apr 2023, 14th IEEE Vehicular Networking Conference (VNC 2023), Poster Session. Coleri, S., Altintas, O., Kargl, F., Higuchi, T., Segata, M. & Klingler, F. (eds.). Istanbul, Turkey: Institute of Electrical and Electronics Engineers (IEEE), p. 151-152, 2 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Projektfortschritte und Entwicklung: Zwei-Phasen-Plasmakatalysereaktor zur Erhöhung der sterilisierenden Wirkung eines flüssigen MediumsZyla, A. A., Apr 2023, 10 p.Research output: Contribution to conferences > Presentation slides
• Simulation of Tetrahedral Profiled Carbon Rovings for Concrete ReinforcementsPenzel, P., Lang, T. G., Weigel, P. B., Gereke, T., Hahn, L., Hilbig, A. & Cherif, C., Apr 2023, In: Materials. 16, 7, 2767Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Spin polarization induced by decoherence in a tunneling one-dimensional Rashba modelVarela, S., Peralta, M., Mujica, V., Berche, B. & Medina, E., Apr 2023, In: SciPost Physics Core. 6, 2, 044Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Spontaneous flow instabilities of active polar fluids in three dimensionsSingh, A., Vagne, Q., Jülicher, F. & Sbalzarini, I. F., Apr 2023, In: Physical Review Research. 5, 2, L022061Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Towards Real-Time Analysis of Gas-Liquid Pipe Flow: A Wire-Mesh Sensor for Industrial ApplicationsWiedemann, P., Dias, F. D. A., Trepte, M., Schleicher, E. & Hampel, U., Apr 2023, In: Sensors. 23, 8, 4067Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Analysis of density-dependent bead and cell structure of expanded polypropylene bead foams from X-ray computed tomography of different resolutionKoch, I., Preiß, G., Müller-Pabel, M., Grüber, B., Meuchelböck, J., Ruckdäschel, H. & Gude, M., 31 Mar 2023, In: Journal of Cellular Plastics. 59, 2, p. 165-184, 20 p.Electronic (full-text) versionResearch output: Contribution to journal > Review article
• Wafer Level Chip Scale Package Failure Mode Prediction using Finite Element ModelingDudash, V., Machani, K. V., Boehme, B., Capecchi, S., Ok, J., Meier, K., Kuechenmeister, F. & 2 others, 30 Mar 2023, 2023 IEEE International Reliability Physics Symposium, IRPS 2023 - Proceedings. Institute of Electrical and Electronics Engineers (IEEE), p. 1-6, 6 p., 10117636Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• 2D LIDAR SLAM Localization System for a Mobile Robotic Platform in GPS Denied EnvironmentRaikwar, S., Yu, H. & Herlitzius, T., 29 Mar 2023, In: Journal of Biosystems Engineering. 48, 2, p. 123-135, 13 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Blind Transmitter Localization Using Deep Learning: A Scalability StudyBizon, I., Nimr, A., Schulz, P., Chafii, M. & Fettweis, G. P., 29 Mar 2023, 2023 IEEE Wireless Communications and Networking Conference (WCNC). Institute of Electrical and Electronics Engineers (IEEE), p. 1-6, 6 p., 10119115Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution