Publications

2024

• Concise Paper: Towards On-board Radiometric Fingerprinting Fully Integrated on an Embedded SystemYan, W., Gütschow, M., Voigt, T. & Rohner, C., 2024, EWSN '24: Proceedings of the 2024 International Conference on Embedded Wireless Systems and Networks. Vol. 1. p. 112 - 117Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Consensus Testing via Relay Networks by Physical-Layer Network CodingRosenberger, J., Boche, H., Cabrera, J. A. & Fitzek, F. H., 2024, GLOBECOM 2024 - 2024 IEEE Global Communications Conference. Institute of Electrical and Electronics Engineers (IEEE), p. 1359-1364, 6 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Constructive Interpolation and Concept-Based Beth Definability for Description Logics via SequentsLyon, T. & Karge, J., 2024, Proceedings of the 33rd International Joint Conference on Artificial Intelligence (IJCAI 2024). Larson, K. (ed.). ijcai.org, p. 3484-3492, 9 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Contact Thermography – New findings, new ideasOppermann, M., Albrecht, O., Zerna, T. & Borngräber, L. S., 2024, 10 TH IEEE ELECTRONICS SYSTEM- INTEGRATION TECHNOLOGY CONFERENCE: Proceedings. Institute of Electrical and Electronics Engineers (IEEE), 6 p.Research output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Context-Oriented Programming and Modeling in Julia with Context Petri NetsGutsche, C., Prokopets, V., Wang, Z., Götz, S. & Aßmann, U., 2024, Proceedings - 2024 50th Euromicro Conference on Software Engineering and Advanced Applications, SEAA 2024. Institute of Electrical and Electronics Engineers (IEEE), p. 1-9, 9 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Contractions Based on Optimal RepairsBaader, F. & Wassermann, R., 2024, Proceedings of the 21st International Conference on Principles of Knowledge Representation and Reasoning (KR 2024). Marquis, P., Marquis, P., Ortiz, M. & Pagnucco, M. (eds.).p. 94-105, 12 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Correction quality criterion for DOPC guide-starsBoehm, J., Krause, D., Koukourakis, N. & Czarske, J. W., 2024, Unconventional Optical Imaging IV. Georgakoudi, I., Georges, M. P. & Verrier, N. (eds.). SPIE - The international society for optics and photonics, 129960FElectronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Correlation Clustering of Bird SoundsStein, D. & Andres, B., 2024, Pattern Recognition - 45th DAGM German Conference, DAGM GCPR 2023, Proceedings: 45th DAGM German Conference, DAGM GCPR 2023, Heidelberg, Germany, September 19–22, 2023, Proceedings. Köthe, U. & Rother, C. (eds.). Springer, Cham, p. 508–523, 16 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• CRISP: Confidentiality, Rollback, and Integrity Storage Protection for Confidential Cloud-Native ComputingHartono, A. P. P., Brito, A. & Fetzer, C., 2024, p. 141-152, 12 p.Electronic (full-text) versionResearch output: Contribution to conferences > Paper
• Cu nanowire fine-pitch joints for next gen heterogeneous chiplet integrationBickel, S., Quednau, S., Birlem, O., Panchenko, J. & Junghahnel, M., 2024, Proceedings - IEEE 74th Electronic Components and Technology Conference, ECTC 2024. Institute of Electrical and Electronics Engineers (IEEE), p. 1376-1381, 6 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution