2022

• Advances in UV-lithographic patterning of multi-layer waveguide stack for single mode polymeric RDLWeyers, D., Nieweglowski, K. & Bock, K., 16 Sep 2022, 2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings. IEEE, p. 405-409, 5 p., 9939517Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Characterization of material adhesion in redistribution multilayer for embedded high-frequency packagesYin, R., Nieweglowski, K., Meier, K. & Bock, K., 16 Sep 2022, 2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 321-325, 5 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Corrosion study on Cu/Sn-Ag solid-liquid interdiffusion microbumps by salt spray testing with 5 wt.% NaCl solutionWenzel, L., Mueller, M., Panchenko, I., Steller, W. & Wolf, M. J., 16 Sep 2022, 2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings. IEEE, p. 330-335, 6 p., 9939408Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Design centering enables robustness screening of pattern formation modelsSolomatina, A., Cezanne, A., Kalaidzidis, Y., Zerial, M. & Sbalzarini, I. F., 16 Sep 2022, In: Bioinformatics. 38, 2 S, p. II134-II140Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Development of a Ultra-Thin Glass Based Pressure Sensor for High-Temperature ApplicationKnoch, P., Meier, K., Schulze, R., Endisch, C., Reichel, L., Esche, M. & Bock, K., 16 Sep 2022, 2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings. IEEE, p. 101-105, 5 p., 9939433Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Feasibility study of magnetically enhanced interconnects for integration of flexible and stretchable electronicsErnst, D., Nieweglowski, K. & Bock, K., 16 Sep 2022, 2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 269-272, 4 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Metallurgical aspects and joint properties of Cu-Ni-In-Cu fine-pitch interconnects for 3D integrationBickel, S., Panchenko, I. & Wolf, M. J., 16 Sep 2022, 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC). IEEE, p. 343-349, 7 p., 9939411Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Novel Cu-nanowire-based technology enabling fine pitch interconnects for 2.5D/3D IntegrationShehzad, A., Yin, R., Panchenko, I., Müller, M., Bickel, S., Birlem, O., Quednau, S. & 1 others, 16 Sep 2022, 2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings. IEEE, p. 118-123, 6 p., 9939420Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Reliability Improvement of Large BGA-Packages Using Sidefill SupportHeine, M., Meier, K., Wambera, L., Bock, K. & Götze, C., 16 Sep 2022, 2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings. IEEE, p. 516-521, 6 p., 9939434Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Beton-3D-Druck - Neues Anwendungsfeld für AutobetonpumpenStorch, F., 15 Sep 2022, Tagungsband Praxis Transportbeton 2022. p. 1-25, 25 p.Research output: Contribution to book/conference proceedings/anthology/report > Conference contribution