Publications

2024

• Towards the understanding of the structure deformation behaviour of meat and meat analogsWilhelm, E., Schmelzeisen, D. O., Rodríguez Agudo, J. A. & Wagemans, A. M., 2024Research output: Contribution to conferences > Presentation slides
• Towards Usability of Process Models for Co-Simulation-Based Operability Analysis of Modular Electrolysis PlantsMock, M., Viedt, I. & Urbas, L., 2024, 2024 IEEE 29th International Conference on Emerging Technologies and Factory Automation, ETFA 2024. Facchinetti, T., Cenedese, A., Bello, L. L., Vitturi, S., Sauter, T. & Tramarin, F. (eds.). Institute of Electrical and Electronics Engineers (IEEE)Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Trackball-Odometry for Increased Position Accuracy of UAV in Aerial Manipulation TasksSchuster, M. S., Spens, T. & Beitelschmidt, M., 2024, VDI Mechatroniktagung 2024. p. 141-146Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Transparenzsteigerung beim Hohlprägewalzen von metallischer Bipolarplatten: Prozessüberwachung mittels maschineninhärenter SensorenWagner, M., Alaluss, M., Langheinrich, J., Reuther, F., Kurth, R. & Ihlenfeldt, S., 2024, In: WT Werkstattstechnik. 114, 1-2, p. 15-20, 6 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Tribological Properties of Different Slipper Designs of an Axial Piston PumpHorn, S., Ivantysyn, R., Schmidt, T., Weber, J. & Schneider, J., 2024, 18 p.Electronic (full-text) versionResearch output: Contribution to conferences > Paper
• Tribometer for the Investigation of Self-Lubricating Sealing Materials under Realistic Compression ConditionsJoswig, M., Klotsche, K. & Thomas, C., 2024, 10 p.Electronic (full-text) versionResearch output: Contribution to conferences > Paper
• Trusted Computing Architectures for IoT DevicesBraeken, A., da Silva, B., Segers, L., Knödtel, J., Reichenbach, M., Wulf, C., Pertuz Mendez, S. A. & 4 others, 2024, Applied Reconfigurable Computing. Architectures, Tools, and Applications - 20th International Symposium, ARC 2024, Proceedings: 20th International Symposium, ARC 2024 Aveiro, Portugal, March 20–22, 2024 Proceedings. Skliarova, I., Jiménez, P. B., Véstias, M. & Diniz, P. C. (eds.). Springer, Cham, p. 241-254, 13 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• TSN over 5G: Overcoming Challenges and Realizing IntegrationWelte, D., Lehmann, C., Schappacher, M., Hoschele, T., Sikora, A. & Fitzek, F. H., 2024, 2024 IEEE 20th International Conference on Factory Communication Systems, WFCS 2024. Mifdaoui, A., Almeida, L., Golatowski, F., Scanzio, S., Santos, P. & Danielis, P. (eds.). Institute of Electrical and Electronics Engineers (IEEE), p. 1-8, 8 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Understanding the impact of the dielectric layer in modulating the TER of FTJ devicesCarpentieri, L., Namlab, S. L., Mikolajick, T. & Slesazeck, S., 2024, ESSERC 2024 - Proceedings: 50th IEEE European Solid-State Electronics Research Conference. IEEE Computer Society, p. 408-411, 4 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Understanding the Substrate Effect on De-embedding Structures Fabricated on SOI Wafers Using Electromagnetic SimulationWesling, B. N., Deng, M., Mukherjee, C., Mikolajick, T., Trommer, J. & Maneux, C., 2024, 2024 IEEE 36th International Conference on Microelectronic Test Structures, ICMTS 2024 - Proceedings. Institute of Electrical and Electronics Engineers (IEEE)Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution