Publications

2023

• Impact of Data Sampling on Performance and Robustness of Machine Learning Models in Production EngineeringConrad, F., Boos, E., Mälzer, M., Wiemer, H. & Ihlenfeldt, S., 2023, Lecture Notes in Production Engineering. Springer Nature, p. 463-472, 10 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Chapter in book/Anthology/Report
• Impedance characteristics at socket outlets in residential and commercial buildings in the frequency range 2-150 kHzKhokhlov, V., Stiegler, R., Meyer, J., Lodetti, S., Davis, P., Wright, P., Fernández, I. & 3 others, 2023, In: CIRED : open access proceedings journal. 2023, 6, p. 950-954, 5 p.Electronic (full-text) versionResearch output: Contribution to journal > Conference article
• Implementation of the XOR gate with two memristive neuronsHorvath, A., Ascoli, A. & Tetzlaff, R., 2023, 2023 12th International Conference on Modern Circuits and Systems Technologies, MOCAST 2023 - Proceedings. Institute of Electrical and Electronics Engineers (IEEE), p. 1-5Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Improvement of cutting tools using laser-induced periodic surface structures for machining Aluminium alloy Al 6061 T6Baumann, R., Bouraoui, Y., Teicher, U., Selbmann, E., Ihlenfeldt, S. & Lasagni, A. F., 2023, Laser-based Micro- and Nanoprocessing XVII. Kling, R., Watanabe, A. & Pfleging, W. (eds.). SPIE - The international society for optics and photonics, 124091BElectronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Improving a Deep Learning Temperature-Forecasting Model of a 3-Axis Precision Machine with Domain Randomized Thermal Simulation DataBoos, E., Thiem, X., Wiemer, H. & Ihlenfeldt, S., 2023, Lecture Notes in Production Engineering. Springer Nature, p. 574-584, 11 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Chapter in book/Anthology/Report
• Improving GPU Matrix Multiplication by Leveraging Bit Level Granularity and CompressionFett, J., Schwarz, C., Kober, U., Habich, D. & Lehner, W., 2023, Datenbanksysteme fur Business, Technologie und Web, BTW 2023. Konig-Ries, B., Scherzinger, S., Lehner, W. & Vossen, G. (eds.). Gesellschaft fur Informatik (GI), p. 763-772, 10 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Improving Radio Environment Maps with Joint Communications and Sensing: An OutlookKrause, A., Schulz, P., Burmeister, F. & Fettweis, G., 2023, 2023 IEEE 3rd International Symposium on Joint Communications & Sensing (JC&S). p. 1-6Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Improving Reliability for Cloud-Native 5G and Beyond Using Network CodingLhamo, O., Doan, T. V., Tasdemir, E., Attawna, M., Senk, S., Fitzek, F. H. & Nguyen, G. T., 2023, 2023 IEEE Conference on Network Function Virtualization and Software Defined Networks, NFV-SDN 2023 - Proceedings. Fitzek, F. H., Horner, L., Gharbaoui, M., Nguyen, G., Gu, R. & Meuser, T. (eds.). Institute of Electrical and Electronics Engineers (IEEE), p. 1-7, 7 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Improving the Vibration Reliability of SAC Flip-Chip Interconnects Using UnderfillHöhne, R., Meier, K., Reim, M., Lehmann, M. & Bock, K. H., 2023, 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. Institute of Electrical and Electronics Engineers (IEEE)Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Increasing Resilience of Production Systems by Dynamic Context Modelling and Process AdaptionWunderlich, T., Hansert, J., Koch, S., Heinrich, R., Schlegel, T. & Ihlenfeldt, S., 2023, In: Procedia CIRP. 118, p. 282-287, 6 p.Electronic (full-text) versionResearch output: Contribution to journal > Conference article