Publications
The Research Portal (FIS) of TU Dresden provides a detailed search for publications in the School of Engineering Sciences.
20083 Entries
2023
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In-Network Path Planning for Autonomous Driving, 2023, 2023 IEEE Conference on Network Function Virtualization and Software Defined Networks, NFV-SDN 2023 - Proceedings. Fitzek, F. H., Horner, L., Gharbaoui, M., Nguyen, G., Gu, R. & Meuser, T. (eds.). Institute of Electrical and Electronics Engineers (IEEE), p. 175-177, 3 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Integration of Digitization and Sustainability Objectives in a Maturity Model-Based Strategy Development Process, 2023, Manufacturing Driving Circular Economy - Proceedings of the 18th Global Conference on Sustainable Manufacturing. Kohl, H., Seliger, G. & Dietrich, F. (eds.). Springer Science and Business Media B.V., p. 918-926, 9 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Intelligent Scheduling in Softwarized 3D Networks for Industrial IoT Applications, 2023, 2023 IEEE Conference on Network Function Virtualization and Software Defined Networks, NFV-SDN 2023 - Proceedings. Fitzek, F. H., Horner, L., Gharbaoui, M., Nguyen, G., Gu, R. & Meuser, T. (eds.). Institute of Electrical and Electronics Engineers (IEEE), p. 185-188, 4 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Intelligent self calibration tool for adaptive few-mode fiber multiplexers using multiplane light conversion, 2023, In: Journal of the European Optical Society-Rapid Publications. 19, 1, 29Electronic (full-text) versionResearch output: Contribution to journal > Research article
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Intermediate wake characteristics behind a circular cylinder, 2023, 14th International ERCOFTAC Symposium on Engineering, Turbulence, Modelling and MeasurementsResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Intermetallic Growth Study of Ultra-Thin Copper and Tin Bilayer for Hybrid Bonding Applications, 2023, 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC). Institute of Electrical and Electronics Engineers (IEEE), p. 866-871, 6 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Interplay Between Priority Queues and Controlled Delay in Programmable Data Planes, 2023, 2023 18th Wireless On-Demand Network Systems and Services Conference, WONS 2023. Institute of Electrical and Electronics Engineers (IEEE), p. 64-71, 8 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Investigating the Impact of Non-Volatile Memories on Energy-Efficiency of Coarse-Grained Reconfigurable Architectures, 2023, Proceedings - 2023 26th Euromicro Conference on Digital System Design, DSD 2023. Niar, S., Ouarnoughi, H. & Skavhaug, A. (eds.). Institute of Electrical and Electronics Engineers (IEEE), p. 748-755, 8 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Investigation of a Heat Pump Dishwasher with Natural Refrigerant Mixture, 2023Research output: Contribution to conferences > Paper
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Investigation of a novel CO2 ultrahigh-lift ejector cycle with an additional subcooling heat exchanger, 2023, 11 p.Electronic (full-text) versionResearch output: Contribution to conferences > Paper