Publications

2023

• Mr-Fosdick at SemEval-2023 Task 5: Comparing Dataset Expansion Techniques for Non-Transformer and Transformer Models: Improving Model Performance through Data AugmentationFalkenberg, C., Schönwälder, E., Rietzke, T., Görner, C. A., Walther, R., Gonsior, J. & Reusch, A., 2023, Proceedings of the 17th International Workshop on Semantic Evaluation (SemEval-2023). Ojha, A. K., Dogruoz, A. S., Da San Martino, G., Madabushi, H. T., Kumar, R. & Sartori, E. (eds.). Association for Computational Linguistics (ACL), p. 88-93, 6 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Multi-criteria numerical optimization of mechanical properties in ultrasonic welding process parameters of PVC-coated hybrid textiles for weather protectionHussen, M. S., Kyosev, Y., Pietsch, K., Boll, J. & Kabish, A. K., 2023, In:  Vlákna a textil = Fibres and textiles . 30, 2, p. 56-73, 18 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Multi layer capacitive strain sensor based on dielectric elastomers for elastic gear rim of jaw couplingProkopchuk, A., Ewert, A., Menning, J., Schlecht, B., Richter, A., Wallmersperger, T. & Henke, E. M., 2023Electronic (full-text) versionResearch output: Contribution to conferences > Poster
• Multi-Level Operation of Ferroelectric FET Memory Arrays for Compute-In-Memory ApplicationsMuller, F., De, S., Lederer, M., Hoffmann, R., Olivo, R., Kampfe, T., Seidel, K. & 6 others, 2023, 2023 IEEE International Memory Workshop, IMW 2023 - Proceedings. Institute of Electrical and Electronics Engineers (IEEE), p. 1-4Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Multi-Objective Optimization of Fractal-Tree Microchannels for Printed Circuit Heat Exchangers by Improved Genetic AlgorithmsYu, F., Ding, W., Unger, S., Luo, X. & Hampel, U., 2023, Proceedings of the 20th International Topical Meeting on Nuclear Reactor Thermal Hydraulics, NURETH 2023. American Nuclear Society, p. 5309-5319, 11 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Multiscale approach for boiling flow simulationDing, W., Zhang, J., Setoodeh, H., Lucas, D. & Hampel, U., 2023, Proceedings of the 20th International Topical Meeting on Nuclear Reactor Thermal Hydraulics, NURETH 2023. American Nuclear Society, p. 1374-1381, 8 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Multitasking and Memcomputing in Memristor Cellular Nonlinear Networks: Insights into the Underlying MechanismsMessaris, I., Ascoli, A., Prousalis, D., Ntinas, V., Demirkol, A. S. & Tetzlaff, R., 2023, Proceedings - 2023 19th International Conference on Synthesis, Modeling, Analysis and Simulation Methods, and Applications to Circuit Design, SMACD 2023. Institute of Electrical and Electronics Engineers (IEEE)Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Nachhaltige Herstellung hochreiner Chitosan- filamentgarne mit hohem Leistungs- und FunktionsvermogenKuznik, I., Kruppke, I. & Cherif, C., 2023, In: Technische Textilien. Vol. 66. p. 26-28, 3 p.Electronic (full-text) versionResearch output: Contribution to specialist publication > Feature article/Contribution (Feuilleton)
• Nachhaltigkeit als Erfolgsfaktor der InnovationSchmauder, M., 2023, Tradition oder Innovation: Wieviel GESTERN braucht das MORGEN?. Düren: Shaker Verlag, Vol. 6. p. 35-46Research output: Contribution to book/conference proceedings/anthology/report > Chapter in book/Anthology/Report
• Nanoscale Mem-Devices for Chemical SensingIbarlucea, B., Yildirim, E. E., Tetzlaff, R., Ascoli, A., Panes-Ruiz, L. A. & Cuniberti, G., 2023, ICECS 2023 - 2023 30th IEEE International Conference on Electronics, Circuits and Systems: Technosapiens for Saving Humanity. Institute of Electrical and Electronics Engineers (IEEE), p. 1-5Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution