Publications

2023

• Reconfigurable ferroelectric hafnium oxide FeFET fabricated in 28 nm CMOS technology for mmWave applicationsAbdulazhanov, S., Le, Q. H., Khoa Huynh, D., Lederer, M., Raffel, Y., Ni, K., Yin, X. & 2 others, 2023, ESSDERC 2023 - IEEE 53rd European Solid-State Device Research Conference. Editions Frontieres, p. 113-116, 4 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Reducing the tunneling barrier thickness of bilayer ferroelectric tunnel junctions with metallic electrodesLancaster, S., Segatto, M., Silva, C., Max, B., Mikolajick, T., Esseni, D., Driussi, F. & 1 others, 2023, 2023 Device Research Conference, DRC 2023. Institute of Electrical and Electronics Engineers (IEEE)Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Reference Network and Localization Architecture for Smart Manufacturing Based on 5GLudwig, S., Aschenbrenner, D., Scharle, M., Klessig, H., Karrenbauer, M., Wu, H., Taghouti, M. & 3 others, 2023, Advances in System-Integrated Intelligence - Proceedings of the 6th International Conference on System-Integrated Intelligence SysInt 2022, Genova, Italy. Valle, M., Lehmhus, D., Gianoglio, C., Ragusa, E., Seminara, L., Bosse, S., Ibrahim, A. & Thoben, K. (eds.). Springer Science and Business Media B.V., p. 470-479, 10 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Reinforcement Learning-Based Receiver for Molecular Communication with MobilityDebus, L. Y., Hofmann, P., Gómez, J. T., Fitzek, F. H. & Dressler, F., 2023, GLOBECOM 2023 - 2023 IEEE Global Communications Conference. Institute of Electrical and Electronics Engineers (IEEE), p. 558-564, 7 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Remote Controlling Mobile Robots with Adaptive Video Streaming and Augmented RealitySossalla, P., Steinke, J., Vielhaus, C. L., Hofer, J., Rischke, J. & Fitzek, F. H., 2023, 2023 IEEE International Black Sea Conference on Communications and Networking, BlackSeaCom 2023. Institute of Electrical and Electronics Engineers (IEEE), p. 45-50, 6 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Representative Answer Sets: Collecting Something of Everything.Böhl, E., Gaggl, S. A. & Rusovac, D., 2023, p. 271-278, 8 p.Electronic (full-text) versionResearch output: Contribution to conferences > Paper
• Resource-efficient Quantum Neuron for Quantum Neural NetworksMaheshwari, S., Li, S. C., Bassoli, R. & Fitzek, F. H., 2023, 2023 IEEE Globecom Workshops, GC Wkshps 2023. Institute of Electrical and Electronics Engineers (IEEE), p. 1045-1050, 6 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Review Of Sinter-Based Additive Manufacturing (SBAM) - Status And ProspectsStudnitzky, T., Zhong, C., Weißgärber, T. & Aumund-Kopp, C., 2023Electronic (full-text) versionResearch output: Contribution to conferences > Paper
• Revision of the AIG Software Toolkit: A Contribute to More User Friendliness and Algorithmic EfficiencyKucharski, S., Damnik, G., Stahr, F. & Braun, I., 2023, Proceedings of the 15th International Conference on Computer Supported Education - Volume 2, CSEDU 2023. Jovanovic, J., Chounta, I., Uhomoibhi, J. & McLaren, B. (eds.). SCITEPRESS - Science and Technology Publications, Vol. 2. p. 410-417, 8 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• RMTRUCK: Deadlock-Free Execution of Multi-Robot Plans Under Delaying DisturbancesSchäfer, J., Keppler, F., Wagner, S. & Janschek, K., 2023, 2023 IEEE 26th International Conference on Intelligent Transportation Systems, ITSC 2023. Institute of Electrical and Electronics Engineers (IEEE), p. 1122-1127, 6 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution