Publications
The Research Portal (FIS) of TU Dresden provides a detailed search for publications in the School of Engineering Sciences.
20083 Entries
2023
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Special Session: Mitigating Side-Channel Attacks Through Circuit to Application Layer Approaches, 2023, Proceedings - 2023 International Conference on Hardware/Software Codesign and System Synthesis, CODES+ISSS 2023. Institute of Electrical and Electronics Engineers (IEEE), p. 8-17, 10 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Spectral Efficiency Analysis for a Spike-Based Pulse Repetition Frequency Modulation Scheme, 2023, 2023 IEEE 3rd International Symposium on Joint Communications and Sensing, JC and S 2023. Institute of Electrical and Electronics Engineers (IEEE), p. 1-6Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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SpiNNaker2: A Large-Scale Neuromorphic System for Event-Based and Asynchronous Machine Learning, 2023, First Workshop on Machine Learning with New Compute Paradigms. 10 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Split CFD-simulation approach for effective quantification of mixed convective heat transfer coefficients on complex machine tool models, 2023, In: Procedia CIRP. 118, p. 199-204, 6 p.Electronic (full-text) versionResearch output: Contribution to journal > Conference article
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Stacked multi-layer capacitive strain sensor based on dielectric elastomers, 2023, 10th ECCOMAS Thematic Conference on Smart Structures and Materials. p. 1657-1668, 12 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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STAMP-Rust: Language and Performance Comparison to C on Transactional Benchmarks, 2023, Benchmarking, Measuring, and Optimizing - 14th Bench Council International Symposium, Bench 2022, Revised Selected Papers. Gainaru, A., Zhang, C. & Luo, C. (eds.). Springer Science and Business Media B.V., p. 160-175, 16 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Standards for Information Models Considering Knowledge Distribution in Modular Plants, 2023, 2023 IEEE 21st International Conference on Industrial Informatics, INDIN 2023. Dorksen, H., Scanzio, S., Jasperneite, J., Wisniewski, L., Man, K. F., Sauter, T., Seno, L., Trsek, H. & Vyatkin, V. (eds.). Institute of Electrical and Electronics Engineers (IEEE), p. 1-7Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Standpoint Linear Temporal Logic, 2023, Proceedings of the 20th International Conference on Principles of Knowledge Representation and Reasoning, KR 2023. Marquis, P., Son, T. C. & Kern-Isberner, G. (eds.). IJCAI Inc, p. 311-321, 11 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Status Quo of Construction Robotics: Potentials, Applications and Challenges, 2023, Construction Logistics, Equipment, and Robotics - Proceedings of the CLEaR Conference 2023: Proceedings of the CLEaR Conference 2023. Fottner, J., Nübel, K. & Matt, D. (eds.). Springer, Cham, p. 149–156, 8 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Stellenwert von Design, 2023, Stellenwert von DesignResearch output: Contribution to book/conference proceedings/anthology/report > Chapter in book/Anthology/Report