Publications

2023

• Solvent-antisolvent interactions in metal halide perovskitesBautista-Quijano, J. R., Telschow, O., Paulus, F. & Vaynzof, Y., 14 Sep 2023, In: Chemical communications. 59, 71, p. 10588-10603, 16 p.Electronic (full-text) versionResearch output: Contribution to journal > Review article
• Cell structure analysis of expanded polypropylene bead foams under compressionKoch, I., Preiß, G., Müller-Pabel, M., Grüber, B., Meuchelböck, J., Ruckdäschel, H. & Gude, M., 12 Sep 2023Electronic (full-text) versionResearch output: Contribution to conferences > Abstract
• Interfacial Engineering of Two-Dimensional Metal-Organic Framework Thin Films for Biomimetic Photoadaptative SensorsYang, H., Sun, Q., Liao, Z., Hambsch, M., Liu, X., Wu, D., Jost, B. & 6 others, 12 Sep 2023, In: Chemistry of materials. 35, 17, p. 7144-7153, 10 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Nemo: First Glimpse of a New Rule EngineIvliev, A., Ellmauthaler, S., Gerlach, L., Marx, M., Meißner, M., Meusel, S. & Krötzsch, M., 12 Sep 2023, Proceedings 39th International Conference on Logic Programming. Pontelli, E., Costantini, S., Dodaro, C., Gaggl, S., Calegari, R., Garcez, A. D., Fabiano, F., Mileo, A., Russo, A. & Toni, F. (eds.).p. 333-335, 3 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Novel concepts to construct cost effective geothermal wells with Electro Pulse Power TechnologyNeumann, E., Anders, E., Voigt, M. & Will, F., 12 Sep 2023Research output: Contribution to conferences > Presentation slides
• Scattering transform in microstructure reconstructionReck, P., Seibert, P., Raßloff, A., Kästner, M. & Peterseim, D., 12 Sep 2023, In: Proceedings in Applied Mathematics and Mechanics: PAMM. 23, 3, e202300169Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Towards cloud-based Control-as-a-Service for modular Process PlantsVogt, L., Klose, A., Khaydarov, V., Vockeroth, C., Endres, C. & Urbas, L., 12 Sep 2023, 2023 IEEE 28th International Conference on Emerging Technologies and Factory Automation (ETFA). Sinaia, Romania: Institute of Electrical and Electronics Engineers (IEEE)Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Influence of plasma coating pretreatment on the adhesion of thermoplastics to metalsKoshukow, W., Liebsch, A., Wippermann, J., Kolbe, B., Kupfer, R., Troschitz, J., Buske, M. & 2 others, 10 Sep 2023, Proceedings of the Munich Symposium on Lightweight Design 2022: Tagungsband zum Münchner Leichtbauseminar 2022. Rieser, J., Endress, F., Horoschenkoff, A., Höfer, P., Dickhut, T. & Zimmermann, M. (eds.). 1 ed., Springer Vieweg, Cham, p. 85-96, 12 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Introduction to the Special Section on Advances in Physical Design AutomationHui-Ru Jiang, I., David, C., Posser, G. & Lienig, J., 9 Sep 2023, In: ACM Transactions on Design Automation of Electronic Systems. 28, 5, 68Electronic (full-text) versionResearch output: Contribution to journal > Editorial (Lead article)
• Access Interval Prediction with Neural Networks for Tightly Coupled Memory SystemsFriedrich, S., Lin, C., Razilov, V., Wittig, R., Matúš, E. & Fettweis, G., 8 Sep 2023, 2023 26th Euromicro Conference on Digital System Design (DSD). Niar, S., Ouarnoughi, H. & Skavhaug, A. (eds.). Institute of Electrical and Electronics Engineers (IEEE), p. 391-398, 8 p., 10456874Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution