Publications

2022

• A 400 MHz 19 dBm Inverse Class-E Power Amplifier for Energy-Efficient Aggressive Duty-CyclingBecker, M. G., Joram, N. & Ellinger, F., 16 Nov 2022, International Conference on Electrical, Computer, Communications and Mechatronics Engineering (ICECCME). Institute of Electrical and Electronics Engineers (IEEE), 5 p., 9988047Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Design, manufacturing and testing of thermoplastic composite multi-cell pressure vessels for hydrogenCondé-Wolter, J., Rohkamm, A., Lebelt, T., Holländer, D., Gruhl, A. & Gude, M., 16 Nov 2022Research output: Contribution to conferences > Presentation slides
• Electron-induced structural changes in flax fiber reinforced PLA/PCL composites, analyzed using the rule of mixturesRytlewski, P., Gohs, U., Stepczyńska, M., Malinowski, R., Karasiewicz, T. & Moraczewski, K., 15 Nov 2022, In:  Industrial crops and products : an international journal. 188, Part A, 10 p., 115587Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Benchmarking AutoML for regression tasks on small tabular data in materials designConrad, F., Mälzer, M., Schwarzenberger, M., Wiemer, H. & Ihlenfeldt, S., 11 Nov 2022, In: Scientific reports. 12, 1, 19350Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Performance Analysis of Memristive-CNN based on a VCM Device ModelWang, Y., Ascoli, A., Tetzlaff, R., Rana, V. & Menzel, S., 11 Nov 2022, 2022 IEEE International Symposium on Circuits and Systems (ISCAS). Institute of Electrical and Electronics Engineers (IEEE), p. 1184-1188, 5 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Printable Reactive Materials for Bonding and JoiningStepien, L., Aslan, N., Tyszler, M., Lux, M., Palluet, R., López, E., Brueckner, F. & 1 others, 11 Nov 2022, 2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings. Institute of Electrical and Electronics Engineers (IEEE), p. 364-367, 4 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Pulse and Breathing Motion Artifacts Correction of Intraoperative Thermal Imaging in NeurosurgeryMoshaei-Nezhad, Y., Oelschlagel, M., Muller, J., Kirsch, M. & Tetzlaff, R., 11 Nov 2022, 2022 IEEE International Symposium on Circuits and Systems (ISCAS). Institute of Electrical and Electronics Engineers (IEEE), p. 1887-1891, 5 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Achieving software-equivalent accuracy for hyperdimensional computing with ferroelectric-based in-memory computingKazemi, A., Müller, F., Sharifi, M. M., Errahmouni, H., Gerlach, G., Kämpfe, T., Imani, M. & 2 others, 10 Nov 2022, In: Scientific reports. 12 (2022), 1, 15 p., 19201Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Generation of Reproducible HVDC-Impulse Composite Voltage Waveforms Using a Triggered Spherical Spark GapDowbysch, A., Goetz, T. & Schlegel, S., 10 Nov 2022, VDE High Voltage Technology; 4. ETG-Symposium. VDE Verlag, Berlin [u. a.], p. 1-6, 6 p., 10048022Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Toward Coarse-Grained Elasticity of Single-Layer Covalent Organic FrameworksCroy, A., Raptakis, A., Bodesheim, D., Dianat, A. & Cuniberti, G., 10 Nov 2022, In: Journal of Physical Chemistry C, Nanomaterials and interfaces. 126, 44, p. 18943-18951, 9 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article