Publications

2023

• Multiscale approach for boiling flow simulationDing, W., Zhang, J., Setoodeh, H., Lucas, D. & Hampel, U., 2023, Proceedings of the 20th International Topical Meeting on Nuclear Reactor Thermal Hydraulics, NURETH 2023. American Nuclear Society, p. 1374-1381, 8 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Multitasking and Memcomputing in Memristor Cellular Nonlinear Networks: Insights into the Underlying MechanismsMessaris, I., Ascoli, A., Prousalis, D., Ntinas, V., Demirkol, A. S. & Tetzlaff, R., 2023, Proceedings - 2023 19th International Conference on Synthesis, Modeling, Analysis and Simulation Methods, and Applications to Circuit Design, SMACD 2023. Institute of Electrical and Electronics Engineers (IEEE)Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Nachhaltige Herstellung hochreiner Chitosan- filamentgarne mit hohem Leistungs- und FunktionsvermogenKuznik, I., Kruppke, I. & Cherif, C., 2023, In: Technische Textilien. Vol. 66. p. 26-28, 3 p.Electronic (full-text) versionResearch output: Contribution to specialist publication > Feature article/Contribution (Feuilleton)
• Nachhaltigkeit als Erfolgsfaktor der InnovationSchmauder, M., 2023, Tradition oder Innovation: Wieviel GESTERN braucht das MORGEN?. Düren: Shaker Verlag, Vol. 6. p. 35-46Research output: Contribution to book/conference proceedings/anthology/report > Chapter in book/Anthology/Report
• Nanoscale Mem-Devices for Chemical SensingIbarlucea, B., Yildirim, E. E., Tetzlaff, R., Ascoli, A., Panes-Ruiz, L. A. & Cuniberti, G., 2023, ICECS 2023 - 2023 30th IEEE International Conference on Electronics, Circuits and Systems: Technosapiens for Saving Humanity. Institute of Electrical and Electronics Engineers (IEEE), p. 1-5Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Nested Sequents for Intermediate Logics: The Case of Gödel-Dummett LogicsLyon, T., 2023, In: Journal of applied non-classical logics. 33, 2, p. 121-164, 44 p., 2Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Nested Sequents for Quantified Modal LogicsLyon, T. S. & Orlandelli, E., 2023, Automated Reasoning with Analytic Tableaux and Related Methods: 32nd International Conference, TABLEAUX 2023, Prague, Czech Republic, September 18–21, 2023, Proceedings. Ramanayake, R. & Urban, J. (eds.). Springer, Cham, p. 449–467, 19 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• NetPU-M: A Generic Reconfigurable Neural Network Accelerator Architecture for MLPsLiu, Y., Rai, S., Ullah, S. & Kumar, A., 2023, 2023 IEEE International Parallel and Distributed Processing Symposium Workshops, IPDPSW 2023. Institute of Electrical and Electronics Engineers (IEEE), p. 85-92, 8 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Network Time Synchronization as a Quantum Physical Layer ServiceNunavath, N., Garbugli, A., Nande, S. S., Foschini, L., Bassoli, R. & Fitzek, F. H., 2023, 28th European Wireless Conference, EW 2023. VDE Verlag, Berlin [u. a.], p. 302-307, 6 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• New Prospects For Fabrication Of Fe-6.5Si Soft Magnetic Components Using Powder MetallurgyLindemann-Geipel, I., Mix, T., Thamm, M., Reuter, K., Kirchner, A., Hutsch, T. & Weißgärber, T., 2023Electronic (full-text) versionResearch output: Contribution to conferences > Paper