Publications
The Research Portal (FIS) of TU Dresden provides a detailed search for publications in the School of Engineering Sciences.
21297 Entries
2023
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Multi-Objective Optimization of Fractal-Tree Microchannels for Printed Circuit Heat Exchangers by Improved Genetic Algorithms, 2023, Proceedings of the 20th International Topical Meeting on Nuclear Reactor Thermal Hydraulics, NURETH 2023. American Nuclear Society, p. 5309-5319, 11 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Multiscale approach for boiling flow simulation, 2023, Proceedings of the 20th International Topical Meeting on Nuclear Reactor Thermal Hydraulics, NURETH 2023. American Nuclear Society, p. 1374-1381, 8 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Multitasking and Memcomputing in Memristor Cellular Nonlinear Networks: Insights into the Underlying Mechanisms, 2023, Proceedings - 2023 19th International Conference on Synthesis, Modeling, Analysis and Simulation Methods, and Applications to Circuit Design, SMACD 2023. Institute of Electrical and Electronics Engineers (IEEE)Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Nachhaltige Herstellung hochreiner Chitosan- filamentgarne mit hohem Leistungs- und Funktionsvermogen, 2023, In: Technische Textilien. Vol. 66. p. 26-28, 3 p.Electronic (full-text) versionResearch output: Contribution to specialist publication > Feature article/Contribution (Feuilleton)
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Nachhaltigkeit als Erfolgsfaktor der Innovation, 2023, Tradition oder Innovation: Wieviel GESTERN braucht das MORGEN?. Düren: Shaker Verlag, Vol. 6. p. 35-46Research output: Contribution to book/conference proceedings/anthology/report > Chapter in book/Anthology/Report
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Nanoscale Mem-Devices for Chemical Sensing, 2023, ICECS 2023 - 2023 30th IEEE International Conference on Electronics, Circuits and Systems: Technosapiens for Saving Humanity. Institute of Electrical and Electronics Engineers (IEEE), p. 1-5Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Nested Sequents for Intermediate Logics: The Case of Gödel-Dummett Logics, 2023, In: Journal of applied non-classical logics. 33, 2, p. 121-164, 44 p., 2Electronic (full-text) versionResearch output: Contribution to journal > Research article
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Nested Sequents for Quantified Modal Logics, 2023, Automated Reasoning with Analytic Tableaux and Related Methods: 32nd International Conference, TABLEAUX 2023, Prague, Czech Republic, September 18–21, 2023, Proceedings. Ramanayake, R. & Urban, J. (eds.). Springer, Cham, p. 449–467, 19 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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NetPU-M: A Generic Reconfigurable Neural Network Accelerator Architecture for MLPs, 2023, 2023 IEEE International Parallel and Distributed Processing Symposium Workshops, IPDPSW 2023. Institute of Electrical and Electronics Engineers (IEEE), p. 85-92, 8 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Network Time Synchronization as a Quantum Physical Layer Service, 2023, 28th European Wireless Conference, EW 2023. VDE Verlag, Berlin [u. a.], p. 302-307, 6 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution