Publications

2023

• Standards for Information Models Considering Knowledge Distribution in Modular PlantsKoch, A., Hamedi, N., Furtner, L., Kock, T., Klose, A. & Madler, J., 2023, 2023 IEEE 21st International Conference on Industrial Informatics, INDIN 2023. Dorksen, H., Scanzio, S., Jasperneite, J., Wisniewski, L., Man, K. F., Sauter, T., Seno, L., Trsek, H. & Vyatkin, V. (eds.). Institute of Electrical and Electronics Engineers (IEEE), p. 1-7Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Standpoint Linear Temporal LogicGigante, N., Álvarez, L. G. & Lyon, T., 2023, Proceedings of the 20th International Conference on Principles of Knowledge Representation and Reasoning, KR 2023. Marquis, P., Son, T. C. & Kern-Isberner, G. (eds.). IJCAI Inc, p. 311-321, 11 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Status Quo of Construction Robotics: Potentials, Applications and ChallengesRichter, C., Kortmann, J., Mischke, J., Will, F. & Otto, J., 2023, Construction Logistics, Equipment, and Robotics - Proceedings of the CLEaR Conference 2023: Proceedings of the CLEaR Conference 2023. Fottner, J., Nübel, K. & Matt, D. (eds.). Springer, Cham, p. 149–156, 8 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Stellenwert von DesignAugsten, A. & Gekeler, M., 2023, Stellenwert von DesignResearch output: Contribution to book/conference proceedings/anthology/report > Chapter in book/Anthology/Report
• Step-by-step transfer function reversal for single-shot 3D fiber endoscopy using a diffuserGlosemeyer, T., Lich, J., Kuschmierz, R. & Czarske, J., 2023, Three-Dimensional and Multidimensional Microscopy: Image Acquisition and Processing XXX. Brown, T. G., Wilson, T. & Waller, L. (eds.). SPIE - The international society for optics and photonics, 1238508Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Stereolithographic Process for Embedding of Electronic Components into Multi-material Flexible and Stretchable Polymer Substrates to Reduce Stress during StretchingTiedje, T., Bräuer, C. & Luniak, M., 2023, In: Advancing Microelectronics. 50, 4, p. 14-19, 6 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Strategic Interaction Over Age of Information on a Quantum Wiretap ChannelBadia, L., Tunc, H. S. D., Aka, A. C., Bassoli, R. & Fitzek, F. H., 2023, 28th European Wireless Conference, EW 2023. VDE Verlag, Berlin [u. a.], p. 388-394, 7 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Study on the use of DEM for the optimization of pelleting rollersKorn, C., Herlitzius, T., Lüpping, K. & Afting, A., 2023, 80th International Conference on Agricultural Engineering: LAND.TECHNIK AgEng 2023. VDI Verlag, Düsseldorf, p. 403-412, 10 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Chapter in book/Anthology/Report
• Surface-Functionalized Multichannel Nanosensors and Machine Learning Analysis for Improved Sensitivity and Selectivity in Gas Sensing ApplicationsPanes-Ruiz, L. A., Huang, S., Riemenschneider, L., Croy, A., Ibarlucea, B. & Cuniberti, G., 2023, Advances in System-Integrated Intelligence - Proceedings of the 6th International Conference on System-Integrated Intelligence SysInt 2022, Genova, Italy. Valle, M., Lehmhus, D., Gianoglio, C., Ragusa, E., Seminara, L., Bosse, S., Ibrahim, A. & Thoben, K. (eds.). Springer Science and Business Media B.V., Vol. 546. p. 700-707, 8 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Syntactic vs Semantic Linear Abstraction and Refinement of Neural NetworksChau, C., Křetínský, J. & Mohr, S., 2023, Automated Technology for Verification and Analysis: 21st International Symposium, ATVA 2023, Singapore, October 24–27, 2023, Proceedings, Part I. André, É. & Sun, J. (eds.). Springer, Cham, p. 401-421, 21 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution