Publications

2022

• Design centering enables robustness screening of pattern formation modelsSolomatina, A., Cezanne, A., Kalaidzidis, Y., Zerial, M. & Sbalzarini, I. F., 16 Sep 2022, In: Bioinformatics. 38, 2 S, p. II134-II140Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Development of a Ultra-Thin Glass Based Pressure Sensor for High-Temperature ApplicationKnoch, P., Meier, K., Schulze, R., Endisch, C., Reichel, L., Esche, M. & Bock, K., 16 Sep 2022, 2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings. Institute of Electrical and Electronics Engineers (IEEE), p. 101-105, 5 p., 9939433Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Feasibility study of magnetically enhanced interconnects for integration of flexible and stretchable electronicsErnst, D., Nieweglowski, K. & Bock, K., 16 Sep 2022, 2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings. Institute of Electrical and Electronics Engineers (IEEE), p. 269-272, 4 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Metallurgical aspects and joint properties of Cu-Ni-In-Cu fine-pitch interconnects for 3D integrationBickel, S., Panchenko, I. & Wolf, M. J., 16 Sep 2022, 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC). Institute of Electrical and Electronics Engineers (IEEE), p. 343-349, 7 p., 9939411Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Novel Cu-nanowire-based technology enabling fine pitch interconnects for 2.5D/3D IntegrationShehzad, A., Yin, R., Panchenko, I., Müller, M., Bickel, S., Birlem, O., Quednau, S. & 1 others, 16 Sep 2022, 2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings. Institute of Electrical and Electronics Engineers (IEEE), p. 118-123, 6 p., 9939420Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Reliability Improvement of Large BGA-Packages Using Sidefill SupportHeine, M., Meier, K., Wambera, L., Bock, K. & Götze, C., 16 Sep 2022, 2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings. Institute of Electrical and Electronics Engineers (IEEE), p. 516-521, 6 p., 9939434Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Beton-3D-Druck - Neues Anwendungsfeld für AutobetonpumpenStorch, F., 15 Sep 2022, Tagungsband Praxis Transportbeton 2022. p. 1-25, 25 p.Research output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• DECO: Optimizing Software-based Soft-Error Detector ConfigurationsThunig, R., Lenz, M., Ulbrich, P. & Schirmeier, H., 15 Sep 2022, Proceedings - 2022 18th European Dependable Computing Conference, EDCC 2022. Institute of Electrical and Electronics Engineers (IEEE), p. 73-80, 8 p., 9933206Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Iodine induced cyclization of sodium aminodiboranate: Reactivity and mechanisms investigationLi, H., Kang, J. X., Ju, M., Wang, Z. Z., Liu, Z., Wang, J., Xu, C. Q. & 2 others, 15 Sep 2022, In: Journal of organometallic chemistry. 975, 122396Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Load Balancing Potentials in 5G NR FR2Rezaei, A., Schulz, P., Awada, A., Viering, I. & Fettweis, G., 15 Sep 2022, 2022 IEEE 33rd Annual International Symposium on Personal, Indoor and Mobile Radio Communications (PIMRC). Institute of Electrical and Electronics Engineers (IEEE), p. 1393-1399, 7 p., 9977585Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution