Publications

2023

• How to measure the accessibility maturity of organizations - A survey on accessibility maturity models for higher education.Auer, N., Kalemba, S., Stormer, C., Böhm, A., Çetin, H., Gutjahr, A., Neumann, F. & 3 others, 2023, In: Frontiers in Computer Science. 5, 1134320Electronic (full-text) versionResearch output: Contribution to journal > Review article
• How to support and integrate operators in CPPS: Insights from competency modelling for adapt and exchange scenariosMiesen, F., Urbas, L. & Narciss, S., 2023, Intelligent Human Systems Integration (IHSI 2023): Integrating People and Intelligent Systems. p. 550–560, 11 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• How to Trade Reliability for Security in Machine-Type Communications: Leakage-Failure Probability MinimizationZhu, Y., Yuan, X., Hu, Y., Schaefer, R. F. & Schmeink, A., 2023, ICC 2023 - IEEE International Conference on Communications: Sustainable Communications for Renaissance. Zorzi, M., Tao, M. & Saad, W. (eds.). Institute of Electrical and Electronics Engineers (IEEE), p. 4353-4359, 7 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Humidity Dependence of the Dielectric Constant of a Thermosetting PolyurethaneLiebscher, H., Suresh, J. N., Li, H., Mersch, J., Wiesner, S. & Gerlach, G., 2023, Proceedings of International Workshop on Impedance Spectroscopy, IWIS 2023. Institute of Electrical and Electronics Engineers (IEEE), p. 63-66, 4 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Hybrid bond and nanowired bump technologies for high density interconnect formation on wafer levelPanchenko, J., Wenzel, L., Bickel, S., Rudolph, C. & Shehzad, A., 2023Electronic (full-text) versionResearch output: Contribution to conferences > Presentation slides
• Hybrid-Lithography for the Master of Multi-ModeWaveguides NIL StampMistry, A., Nieweglowski, K. & Bock, K., 2023, 2023 46th International Spring Seminar on Electronics Technology, ISSE 2023. IEEE Computer SocietyElectronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Hybrid Spiking and Artificial Neural Networks for Radar-Based Gesture RecognitionGerhards, P., Weih, M., Huang, J., Knobloch, K. & Mayr, C. G., 2023, 2023 8th International Conference on Frontiers of Signal Processing, ICFSP 2023. Institute of Electrical and Electronics Engineers (IEEE), p. 83-87, 5 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Hybrid Testbed for Security Research in Software-Defined NetworksWindisch, F., Abedi, K., Doan, T., Strufe, T. & Nguyen, G. T., 2023, 2023 IEEE Conference on Network Function Virtualization and Software Defined Networks, NFV-SDN 2023 - Proceedings. Fitzek, F. H., Horner, L., Gharbaoui, M., Nguyen, G., Gu, R. & Meuser, T. (eds.). Institute of Electrical and Electronics Engineers (IEEE), p. 147-152, 6 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Hybrid User Interfaces: Complementary Interfaces for Mixed Reality InteractionHubenschmid, S., Zagermann, J., Dachselt, R., Elmqvist, N., Feiner, S., Feuchtner, T., Lee, B. & 2 others, 2023, 22nd IEEE International Symposium on Mixed and Augmented Reality (ISMAR 2023)Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• HYDRA - High Yield Dense Robotic ArmsGrohmann, A. I., Peters, F., Kuß, D., Sossalla, P. & Fitzek, F. H., 2023, 2023 3rd International Conference on Electrical, Computer, Communications and Mechatronics Engineering (ICECCME). p. 1-6, 6 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution