Publications

2023

• SpiNNaker2: A Large-Scale Neuromorphic System for Event-Based and Asynchronous Machine LearningGonzalez, H. A., Huang, J., Kelber, F., Nazeer, K. K., Langer, T. H., Liu, C., Lohrmann, M. A. & 7 others, 2023, First Workshop on Machine Learning with New Compute Paradigms. 10 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Split CFD-simulation approach for effective quantification of mixed convective heat transfer coefficients on complex machine tool modelsKumar, T. S., Geist, A., Naumann, C., Glänzel, J. & Ihlenfeldt, S., 2023, In: Procedia CIRP. 118, p. 199-204, 6 p.Electronic (full-text) versionResearch output: Contribution to journal > Conference article
• Stacked multi-layer capacitive strain sensor based on dielectric elastomersProkopchuk, A., Ewert, A., Menning, J., Richter, A., Schlecht, B., Wallmersperger, T. & Henke, E. M., 2023, 10th ECCOMAS Thematic Conference on Smart Structures and Materials. p. 1657-1668, 12 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• STAMP-Rust: Language and Performance Comparison to C on Transactional BenchmarksSuchert, F. & Castrillon, J., 2023, Benchmarking, Measuring, and Optimizing - 14th Bench Council International Symposium, Bench 2022, Revised Selected Papers. Gainaru, A., Zhang, C. & Luo, C. (eds.). Springer Science and Business Media B.V., p. 160-175, 16 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Standards for Information Models Considering Knowledge Distribution in Modular PlantsKoch, A., Hamedi, N., Furtner, L., Kock, T., Klose, A. & Madler, J., 2023, 2023 IEEE 21st International Conference on Industrial Informatics, INDIN 2023. Dorksen, H., Scanzio, S., Jasperneite, J., Wisniewski, L., Man, K. F., Sauter, T., Seno, L., Trsek, H. & Vyatkin, V. (eds.). Institute of Electrical and Electronics Engineers (IEEE), p. 1-7Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Standpoint Linear Temporal LogicGigante, N., Álvarez, L. G. & Lyon, T., 2023, Proceedings of the 20th International Conference on Principles of Knowledge Representation and Reasoning, KR 2023. Marquis, P., Son, T. C. & Kern-Isberner, G. (eds.). IJCAI Inc, p. 311-321, 11 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Status Quo of Construction Robotics: Potentials, Applications and ChallengesRichter, C., Kortmann, J., Mischke, J., Will, F. & Otto, J., 2023, Construction Logistics, Equipment, and Robotics - Proceedings of the CLEaR Conference 2023: Proceedings of the CLEaR Conference 2023. Fottner, J., Nübel, K. & Matt, D. (eds.). Springer, Cham, p. 149–156, 8 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Stellenwert von DesignAugsten, A. & Gekeler, M., 2023, Stellenwert von DesignResearch output: Contribution to book/conference proceedings/anthology/report > Chapter in book/Anthology/Report
• Step-by-step transfer function reversal for single-shot 3D fiber endoscopy using a diffuserGlosemeyer, T., Lich, J., Kuschmierz, R. & Czarske, J., 2023, Three-Dimensional and Multidimensional Microscopy: Image Acquisition and Processing XXX. Brown, T. G., Wilson, T. & Waller, L. (eds.). SPIE - The international society for optics and photonics, 1238508Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Stereolithographic Process for Embedding of Electronic Components into Multi-material Flexible and Stretchable Polymer Substrates to Reduce Stress during StretchingTiedje, T., Bräuer, C. & Luniak, M., 2023, In: Advancing Microelectronics. 50, 4, p. 14-19, 6 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article