Publications

2022

• Electromagnetic Modelling of Current Density Distribution in Power Plug-In ConnectorsPomsel, M., Israel, T., Schlegel, S., Hildmann, C. & Kufner, T., 2022, 31st International Conference on Electrical ContactsResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Electron Emitting C12A7-Mo Composites with Improved Electronic, Thermal and Mechanical PropertiesWätzig, K., Schilm, J., Drobny, C., Tajmar, M. & Kusnezoff, M., 2022, 20th Plansee Seminar. May 30-June 3Research output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Electron Transmission in Macroscopic Borosilicate Capillaries with Bending Angles of 90° and 360°Nguyen, H., Wulfkühler, J. & Tajmar, M., 2022, 35th International Vacuum Nanoelectronics Conference (IVNC). July 5-8Research output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Elektrotaktile Wahrnehmung in Abhängigkeit unterschiedlicher ArbeitsumgebungsbedingungenGröllich, D., 2022, Technologie und Bildung in hybriden Arbeitswelten: 68. Kongress der Gesellschaft für Arbeitswissenschaft. GfA-Press, 6 p., D.1.3Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Embeddings of Task Mappings to Multicore SystemsGoens, A. & Castrillon, J., 2022, Embedded Computer Systems: Architectures, Modeling, and Simulation. Springer, Berlin [u. a.], p. 161-176, 16 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Chapter in book/Anthology/Report
• Empirical Modelling of ReRAM Measured Characteristics Using Charge and FluxAl Chawa, M. M., De Benito, C., Castan, H., Duenas, S., Stavrinides, S. G., Tetzlaff, R. & Picos, R., 2022, 2022 11th International Conference on Modern Circuits and Systems Technologies, MOCAST 2022. Institute of Electrical and Electronics Engineers (IEEE)Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• END-TRUE: Emerging Nanotechnology-Based Double-Throughput True Random Number GeneratorRai, S., Gupta, N., Bhattacharjee, A., Rupani, A., Raitza, M., Trommer, J., Mikolajick, T. & 1 others, 2022, VLSI-SoC: Technology Advancement on SoC Design - 29th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2021, Revised and Extended Selected Papers. Grimblatt, V., Chang, C. H., Chattopadhyay, A., Reis, R. & Calimera, A. (eds.). Springer Science and Business Media B.V., p. 175-203, 29 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Endurance improvements and defect characterization in ferroelectric FETs through interface fluorinationRaffel, Y., Olivo, R., Lederer, M., Muller, F., Hoffmann, R., Ali, T., Mertens, K. & 7 others, 2022, 2022 IEEE International Memory Workshop (IMW). DresdenElectronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Energie einsparen mit additiv gefertigten ZerspanwerkzeugenDenkena, B., Bergmann, B., Relard, A., Hein, M., Abel, J. & Pötschke, J., 2022, In: VDI-Z Integrierte Produktion. 164, 9, p. 48-51, 4 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Energy Efficiency Analysis and Experimental Test of a Closed-Circuit Pneumatic SystemNazarov, F. & Weber, J., 2022Electronic (full-text) versionResearch output: Contribution to conferences > Paper