Publications

2022

• Board Level Reliability Study on Large Antenna-in-Package Solutions for Automotive Radar ApplicationsMeier, K., Schaulin, M., Gotze, C., Wieland, M. & Bock, K., 2022, 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC). Singapore: Institute of Electrical and Electronics Engineers (IEEE), p. 734-743, 10 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• BOUNCE: Memory-Efficient SIMD Approach for Lightweight Integer Compression.Hildebrandt, J., Habich, D. & Lehner, W., 2022, Proceedings of the 38th International Conference on Data Engineering Workshops (ICDEW). p. 123-128, 6 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Brake Discs Made of Aluminum-Matrix-CompositesTrapp, J., Schubert, T., Storz, A., Mitica, D., Anasiei, I. & Weißgärber, T., 2022, World PM 2022 Congress Proceedings. European Powder Metallurgy Association (EPMA)Research output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Capturing Homomorphism-Closed Decidable Queries with Existential Rules (Extended Abstract)Bourgaux, C., Carral, D., Krötzsch, M., Rudolph, S. & Thomazo, M., 2022, Proceedings of the 31st International Joint Conference on Artificial Intelligence, IJCAI 2022. De Raedt, L. & De Raedt, L. (eds.). International Joint Conferences on Artificial Intelligence, p. 5269-5273, 5 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Carbon fiber/polymer-based composites for wearable sensors: A ReviewNag, A., Nuthalapati, S. & Mukhopadhyay, S. C., 2022, In: IEEE Sensors Journal. 22, 11, p. 10235 - 10245, 11 p.Electronic (full-text) versionResearch output: Contribution to journal > Review article
• Carina – A Corpus of Aligned German Read Speech Including AnnotationsKath, H., Stone, S., Rapp, S. & Birkholz, P., 2022, ICASSP 2022 - 2022 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP). p. 6157-6161, 5 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Centrifugal liquid sedimentation methodsMinelli, C., Babick, F., Kestens, V. & Lerche, D., 2022, Particle Separation Techniques: Fundamentals, Instrumentation, and Selected Applications. Contado, C. (ed.). 1 ed., Amsterdam, Oxford, Cambridge: Elsevier Science B.V., p. 541-577, 37 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Chapter in book/Anthology/Report
• CFD-Based Modeling of a Cohesively Separating Soil Layer in Consideration of Local Soil DistributionGolla, C., Köhler, H. & Rüdiger, F., 2022, Proceedings of 14th International Conference on Heat Exchanger Fouling and Cleaning 2022Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• CFD-Based Three-Dimensional Modeling of an Adhesively Detaching Soil Layer in a Channel Flow With Sudden ExpansionGolla, C., Köhler, H., Liebmann, V., Fröhlich, J. & Rüdiger, F., 2022, Proceedings of the International Conference on Fouling & Cleaning in Food Processing 2022Research output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Challenges and Perspectives for Energy-efficient Brain-inspired Edge Computing Applications (Invited Paper)Covi, E., Lancaster, S., Slesazeck, S., Deshpande, V., Mikolajick, T. & Dubourdieu, C., 2022, 2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS). Institute of Electrical and Electronics Engineers (IEEE)Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution