Publications

2021

• Cross-rolling process for manufacturing lightweight hybrid componentsGuilleaume, C. & Brosius, A., Jun 2021, In: Journal of Advanced Joining Processes. 3, 6 p., 100063Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Demystifying Attestation in Intel Trust Domain Extensions via Formal VerificationSardar, M. U., Musaev, S. & Fetzer, C., Jun 2021, p. 83067 - 83079, 13 p.Electronic (full-text) versionResearch output: Contribution to conferences > Paper
• DE - unimorph membrane (DEUM) headphone driverBakardjiev, P., Altinsoy, M. E., Richter, A., Marschner, U. & Franke, M., Jun 2021Research output: Contribution to conferences > Poster
• Domains and domain dynamics in fluorite-structured ferroelectricsLee, D. H., Lee, Y., Yang, K., Park, J. Y., Kim, S. H., Reddy, P. R. S., Materano, M. & 5 others, Jun 2021, In: Applied Physics Reviews. 8, 2, 021312 Electronic (full-text) versionResearch output: Contribution to journal > Review article
• Enabling Energy-Efficient Tbit/s Communications by 1-Bit Quantization and OversamplingNeuhaus, P., Schlüter, M., Jans, C., Dörpinghaus, M. & Fettweis, G., Jun 2021, 2021 Joint European Conference on Networks and Communications and 6G Summit, EuCNC/6G Summit 2021. Virtual Conference (Porto, Portugal), p. 84-89, 6 p., 9482427Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Energy-Efficient Low-Latency Signed Multiplier for FPGA-Based Hardware Accelerators.Ullah, S., Nguyen, T. D. A. & Kumar, A., Jun 2021, In: IEEE Embed. Syst. Lett.. 13, 2, p. 41-44, 4 p., 9094238Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Grand Challenges in Immersive AnalyticsEns, B., Bach, B., Cordeil, M., Engelke, U., Serrano, M., Willett, W., Prouzeau, A. & 17 others, Jun 2021, CHI '21: Proceedings of the 2021 CHI Conference on Human Factors in Computing Systems: Making Waves, Combining Strengths. New York, NY, USA: Association for Computing Machinery (ACM), New YorkElectronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Hardware Acceleration of EEG-based Emotion Classification Systems: A Comprehensive SurveyGonzalez, H. A., George, R. M., Muzaffar, S., Acevedo, J., Höppner, S., Mayr, C., Yoo, J. & 2 others, Jun 2021, In: IEEE transactions on biomedical circuits and systems. 15, 3, p. 412-442, 31 p., 9454320Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Influence of copper interlayers on the magnetic pulse welding process between aluminum and steelBellmann, J., Roder, K., Zimmermann, M., Beyer, E., Kroll, L. & Nestler, D., Jun 2021, In: Metals. 11, 6, 868Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Investigating the Impact of Real-World Environments on the Perception of 2D Visualizations in Augmented RealitySatkowski, M. & Dachselt, R., Jun 2021, Proceedings of the 2021 CHI Conference on Human Factors in Computing Systems: Making Waves, Combining Strengths. New York, NY, USA: Association for Computing Machinery (ACM), New York, 15 p., 522Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution