Publications
The Research Portal (FIS) of TU Dresden provides a detailed search for publications in the School of Engineering Sciences.
18982 Entries
2020
-
Process data-based knowledge discovery in additive manufacturing of ceramic materials by multi-material jetting (CerAM MMJ) , Jul 2020, In: Journal of manufacturing and materials processing. 4, 3, 74Electronic (full-text) versionResearch output: Contribution to journal > Research article
-
Quantum and transport lifetimes in optically induced GaN/AlGaN 2DEGs grown on bulk GaN , Jul 2020, In: Journal of vacuum science & technology : JVST ; B, Nanotechnology & microelectronics : materials, processing, measurement, & phenomena. 38, 4, 042203Electronic (full-text) versionResearch output: Contribution to journal > Research article
-
The german-speaking twitter community reference data set , Jul 2020, IEEE INFOCOM 2020 - IEEE Conference on Computer Communications Workshops, INFOCOM WKSHPS 2020. Institute of Electrical and Electronics Engineers Inc., p. 1172-1177, 6 p., 9162728Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
-
Top-Down Fabricated Reconfigurable FET With Two Symmetric and High-Current On-States , Jul 2020, In: IEEE electron device letters. 41, 7, p. 1110 - 1113, 4 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
-
Toward an ICT-Based Service Oriented Health Care Paradigm , Jul 2020, In: IEEE Consumer Electronics Magazine. 9, 4, p. 77-82, 6 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
-
Anisotropic Exclusion Effect between Photocatalytic Ag/AgCl Janus Particles and Passive Beads in a Dense Colloidal Matrix , 30 Jun 2020, In: Langmuir. 36, 25, p. 7091-7099, 9 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
-
Electro-optical co-integration of chip-components in optical transceivers for optical inter-chip communication , 30 Jun 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC). IEEE, p. 139-147, 9 p., 9159256Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
-
Low Temperature Vibration Reliability of Lead-free Solder Joints , 30 Jun 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC). IEEE, p. 801-806, 6 p., 9159478Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
-
Nearly zero energy renovation concepts for apartment buildings , 30 Jun 2020, In: E3S Web of Conferences. 172, 18009Electronic (full-text) versionResearch output: Contribution to journal > Conference article
-
Miniature hydraulics for a mechatronic lower limb prosthesis , 26 Jun 2020, Volume 3 - ConferenceElectronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution