2020

• Poster Abstract: An Open Source Approach to Field Testing of WLAN up to IEEE 802.11ad at 60 GHz Using Commodity Hardware.Klingler, F., Hauptmeier, F., Sommer, C. & Dressler, F., Jul 2020, 39th IEEE International Conference on Computer Communications (INFOCOM 2020), Poster Session. IEEE, p. 1312-1313, 2 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Probabilistic Finite Element Analysis of Cooled High-Pressure Turbine Blades—Part B: Probabilistic AnalysisHögner, L., Voigt, M., Mailach, R. & Meyer, M., Jul 2020, In: Journal of TurbomachineryResearch output: Contribution to journal > Research article
• Process data-based knowledge discovery in additive manufacturing of ceramic materials by multi-material jetting (CerAM MMJ)Lang, V., Weingarten, S., Wiemer, H., Scheithauer, U., Glausch, F., Johne, R., Michaelis, A. & 1 others, Jul 2020, In: Journal of manufacturing and materials processing. 4, 3, 74Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Quantum and transport lifetimes in optically induced GaN/AlGaN 2DEGs grown on bulk GaNKrückeberg, L., Wirth, S., Solovyev, V. V., Großer, A., Kukushkin, I. V., Mikolajick, T. & Schmult, S., Jul 2020, In:  Journal of vacuum science & technology : JVST ; B, Nanotechnology & microelectronics : materials, processing, measurement, & phenomena. 38, 4, 042203Electronic (full-text) versionResearch output: Contribution to journal > Research article
• The german-speaking twitter community reference data setPflugmacher, J., Escher, S., Reubold, J. & Strufe, T., Jul 2020, IEEE INFOCOM 2020 - IEEE Conference on Computer Communications Workshops, INFOCOM WKSHPS 2020. Institute of Electrical and Electronics Engineers Inc., p. 1172-1177, 6 p., 9162728Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Top-Down Fabricated Reconfigurable FET With Two Symmetric and High-Current On-StatesSimon, M., Liang, B., Fischer, D., Knaut, M., Tahn, A., Mikolajick, T. & Weber, W. M., Jul 2020, In: IEEE electron device letters. 41, 7, p. 1110 - 1113, 4 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Toward an ICT-Based Service Oriented Health Care ParadigmAntonopoulos, C. P., Keramidas, G., Voros, N. S., Huebner, M., Schwiegelshohn, F., Goehringer, D., Dagioglou, M. & 3 others, Jul 2020, In: IEEE Consumer Electronics Magazine. 9, 4, p. 77-82, 6 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Anisotropic Exclusion Effect between Photocatalytic Ag/AgCl Janus Particles and Passive Beads in a Dense Colloidal MatrixHuang, T., Gobeil, S., Wang, X., Misko, V., Nori, F., De Malsche, W., Fassbender, J. & 3 others, 30 Jun 2020, In: Langmuir. 36, 25, p. 7091-7099, 9 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Electro-optical co-integration of chip-components in optical transceivers for optical inter-chip communicationNieweglowski, K., Lorenz, L., Bock, K., Catuneanu, M. & Jamshidi, K., 30 Jun 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC). IEEE, p. 139-147, 9 p., 9159256Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Low Temperature Vibration Reliability of Lead-free Solder JointsMeier, K., Ochmann, M., Bock, K., Leslie, D. & Dasgupta, A., 30 Jun 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC). IEEE, p. 801-806, 6 p., 9159478Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution