2020

• Cellular approach as a principle in integrated energy system planning and operationUhlemeyer, B., Jakob, J., Zdrallek, M., Baumann, C., Wellßow, W., Dickert, J., Rasti, S. J. & 2 others, 23 Sep 2020, CIRED 2020 Berlin Workshop (CIRED 2020). IET, Vol. 2020. p. 58-61, 4 p., 9583025Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Challenges to use flexibility in low-voltage networks – results of a pilot projectHable, M., Knoll, R., Darda, T., Hänchen, H., Schmidt, M., Kreutziger, M., Schegner, P. & 1 others, 23 Sep 2020, CIRED 2020 Berlin Workshop (CIRED 2020). IET, Vol. 2020. p. 297-300, 4 p., 9583037Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Medical Imaging of Microrobots: Toward in Vivo ApplicationsAziz, A., Pane, S., Iacovacci, V., Koukourakis, N., Czarske, J., Menciassi, A., Medina-Sánchez, M. & 1 others, 22 Sep 2020, In: ACS nano. 14, 9, p. 10865-10893, 29 p.Electronic (full-text) versionResearch output: Contribution to journal > Review article
• TouchPen: Rich Interaction Technique for Audio-Tactile Charts by Means of Digital PensEngel, C., Konrad, N. & Weber, G., 20 Sep 2020, Lecture Notes in Computer ScienceElectronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Grain Structure Analysis of Cu/SiO2 Hybrid Bond Interconnects after Reliability TestingPanchenko, I., Wambera, L., Mueller, M., Rudolph, C., Hanisch, A., Bartusseck, I. & Wolf, M. J., 18 Sep 2020, 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC). IEEE, p. 1-7, 7 p., 9229743Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Influence of Temperature Cycling on Asymmetric Optical Bus CouplersLorenz, L., Ott, L., Nieweglowski, K. & Bock, K., 18 Sep 2020, 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC). IEEE, p. 1-5, 5 p., 9229684Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Low Temperature Solid State Bonding of Cu-In Fine-Pitch InterconnectsBickel, S., Panchenko, I., Tachikawa, W. & Wolf, M. J., 18 Sep 2020, 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC). IEEE, p. 1-5, 5 p., 9229826Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Sound transmission loss of a sandwich plate with adjustable core layer thicknessEhrig, T., Dannemann, M., Luft, R., Adams, C., Modler, N. & Kostka, P., 18 Sep 2020, In: Materials. 13, 18, 10 p., 4160Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Improving Linux-Kernel Tests for LockDoc with Feedback-driven FuzzingLochmann, A., Thunig, R. & Schirmeier, H., 16 Sep 2020Electronic (full-text) versionResearch output: Contribution to conferences > Paper
• More Reliable Remote Heart Rate Measurement by Signal Quality IndexesErnst, H., Malberg, H. & Schmidt, M., 16 Sep 2020, 47th Conference Computing in Cardiology (CinC). Wiley-IEEE Press, p. 1-4, 4 p., 9344268Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution