2020

• On composite model calibration for extreme impact loading exemplified on aerospace structuresHaufe, A., Cavariani, S., Liebold, C., Usta, T., Kotzakolios, T., Giannaros, E., Kostopoulos, V. & 5 others, Jun 2020, 16th International LS-DYNA Users Conference. Livermore Software Technology Corporation, 14 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Oscillatory surface deformation of paramagnetic rare-earth solutions driven by an inhomogeneous magnetic fieldFritzsche, B., Mutschke, G., Meinel, T. J., Yang, X., Lei, Z. & Eckert, K., Jun 2020, In: Physical Review E. 101, 6, 062601Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Outage prediction for URLLC in rayleigh fadingTraßl, A., Scheuvens, L., Hößler, T., Schmitt, E., Franchi, N. & Fettweis, G. P., Jun 2020, 2020 European Conference on Networks and Communications, EuCNC 2020. Institute of Electrical and Electronics Engineers Inc., p. 116-121, 6 p., 9200953Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Parametric Markov chains: PCTL complexity and fraction-free Gaussian eliminationBaier, C., Hensel, C., Hutschenreiter, L., Junges, S., Katoen, J. P. & Klein, J., Jun 2020, In: Information and computation. 272, 104504Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Photogrammetric determination of 3D crack opening vectors from 3D displacement fieldsLiebold, F., Maas, H. & Deutsch, J., Jun 2020, In: ISPRS journal of photogrammetry and remote sensing. 164, p. 1-10, 10 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Reliability Assessment of mmWave ModulesWambera, L., Meier, K., Bock, K., Götze, C. & Wieland, M., Jun 2020, Proceedings - IEEE 70th Electronic Components and Technology Conference, ECTC 2020. Institute of Electrical and Electronics Engineers Inc., p. 762-768, 7 p., 9159235Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Simulation-based developement of a nanoscale, electrospun, biomimetic PCL/SF TM implantChen, Z., Benecke, L., Stoppe, T., Hümbert, M., Kempert, P., Bornitz, M., Aibibu, D. & 2 others, Jun 2020, In: Laryngo-Rhino-Otologie. 2020, 02Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Size effect of electronic properties in highly arsenic-doped silicon nanowiresMauersberger, T., Ibrahim, I., Grube, M., Heinzig, A., Mikolajick, T. & Weber, W. M., Jun 2020, In: Solid-state electronics. 168, 107724Electronic (full-text) versionResearch output: Contribution to journal > Research article
• SoC compatible 1 T1 C FeRAM memory array based on ferroelectric Hf0.5Zr0.5O2Okuno, J., Kunihiro, T., Konishi, K., Maemura, H., Shute, Y., Sugaya, F., Materano, M. & 7 others, Jun 2020, 2020 IEEE Symposium on VLSI Technology. Honolulu: IEEE Xplore, 9265063Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Sub-THz Wideband System Employing 1-bit Quantization and Temporal OversamplingNeuhaus, P., Dörpinghaus, M., Halbauer, H., Wesemann, S., Schlüter, M., Gast, F. & Fettweis, G., Jun 2020, IEEE International Conference on Communications (ICC). Dublin, Ireland, p. 1-7, 7 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution