Publications

2021

• Back-bias reconfigurable field effect transistor: A flexible add-on functionality for 22 nm FDSOISessi, V., Simon, M., Slesazeck, S., Drescher, M., Mulaosmanovic, H., Li, K., Binder, R. & 13 others, 2021, 2021 Silicon Nanoelectronics Workshop, SNW 2021. Institute of Electrical and Electronics Engineers (IEEE)Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Bauteilnahe Beanspruchungen und GestaltungsrichtlinienWeidenmann, K., Bobbert, M., Dammann, C., Günther, F., Grützner, R., Herwig, A., Hirsch, F. & 8 others, 2021, Intrinsische Hybridverbunde für Leichtbautragstrukturen: Grundlagen der Fertigung, Charakterisierung und Auslegung. Neuerscheinung ed., p. 265-286, 22 p.Research output: Contribution to book/conference proceedings/anthology/report > Chapter in book/Anthology/Report
• Bildgebungsbasiertes individuelles Design und additive Fertigung von osteochondralen KnochenersatzstrukturenSembdner, P., Kilian, D., Hofmann, D., Holtzhausen, S., Ahlfeld, T., Lode, A., Stelzer, R. & 1 others, 2021, Konstruktion für die Additive Fertigung 2020. p. 19-35, 17 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Chapter in book/Anthology/Report
• BioCare: An Energy-Efficient CGRA for Bio-Signal Processing at the EdgeEbrahimi, Z. & Kumar, A., 2021, 2021 IEEE International Symposium on Circuits and Systems, ISCAS 2021 - Proceedings. Institute of Electrical and Electronics Engineers (IEEE), p. 1-5, 5 p., 9401461Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Biologically inspired load adapted 3D textile reinforcement structuresFriese, D. & Cherif, C., 2021, In: Technical textiles : Trendguide : trends and innovations. 64, 2, p. E117Research output: Contribution to journal > Research article
• Board Level Temperature Cycling Reliability of mmWave Modules on Hybrid SubstratesWambera, L., Meier, K., Bock, K., Götze, C. & Wieland, M., 2021, Proceedings - Electronic Components and Technology Conference. San Diego: Institute of Electrical and Electronics Engineers (IEEE), p. 910-917, 8 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• BROFY: Towards Essential Integrity Protection for MicroservicesHartono, A. P. P. & Fetzer, C., 2021, p. 154-163, 10 p.Electronic (full-text) versionResearch output: Contribution to conferences > Paper
• Calculations and metallographic investigations on the growth of Al₂O₃-layers in bimetallic contactsOberst, M., Schlegel, S. & Großmann, S., 2021, 30th International Conference on Electrical Contacts, ICEC 2020 - Proceedings. Weichert, H. (ed.). Electrosuisse, Verband fur Elektro-, Energie und Informationstechnik, p. 412-419, 8 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Calculation, Visualization, and Comparison of Phase Equilibria of Ternary Mixtures Using Different Mixture ModelsKoch, A., Mickoleit, E., Jäger, A. & Breitkopf, C., 2021Research output: Contribution to conferences > Poster
• Can gadolinium compete with La-Fe-Co-Si in a thermomagnetic generator?Dzekan, D., Diestel, A., Berger, D., Nielsch, K. & Fähler, S., 2021, In: Science and technology of advanced materials. 22, 1, p. 643-657, 15 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article