Publications

2025

• CINM (Cinnamon): A Compilation Infrastructure for Heterogeneous Compute In-Memory and Compute Near-Memory ParadigmsKhan, A. A., Farzaneh, H., Friebel, K. F. A., Fournier, C., Chelini, L. & Castrillon, J., 10 Apr 2025, ASPLOS 2024 - Proceedings of the 29th ACM International Conference on Architectural Support for Programming Languages and Operating Systems. Association for Computing Machinery, p. 31-46, 16 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Fault Tolerance of Sorting Algorithms Under Varying Input CharacteristicsSchwarz, S., Thunig, R. & Schirmeier, H., 10 Apr 2025, 2025 20th European Dependable Computing Conference (EDCC). Institute of Electrical and Electronics Engineers (IEEE), p. 63-71, 9 p., 11107374Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• From tissue to sound: A new paradigm for medical sonic interaction designMatinfar, S., Dehghani, S., Salehi, M., Sommersperger, M., Navab, N., Faridpooya, K., Fairhurst, M. & 1 others, 10 Apr 2025, In: Medical Image Analysis. 103, 13 p., 103571Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Development and Evaluation of Global-Local Finite Element Models for Solder Joint Reliability under Combined Vibration and Thermal LoadsLyu, C., Meier, K. & Bock, K., 9 Apr 2025, Proceedings - 2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2025. Institute of Electrical and Electronics Engineers (IEEE), 7 p., 11006543Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Temperature-Dependent Material Characterization of Back-End-of-Line Copper with Nanoindentation for FEM-Based Wafer Warpage PredictionSingh, P. K., Geisler, H., Machani, K. V., Breuer, D., Meier, K., Kuechenmeister, F. & Bock, K., 9 Apr 2025, Proceedings - 2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2025. Institute of Electrical and Electronics Engineers (IEEE), 13 p., 11006541Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• The role of electron beam irradiation in tailoring porous carbon fibers for enhanced battery and energy storage applicationsSadeghi Bogar, M., Wolf, J., Gude, M., Seidel-Greiff, R. & Behnisch, T., 8 Apr 2025Research output: Contribution to conferences > Abstract
• The Worry Gallery: Feasability trial of an anxiety induction method applying generative artificial intelligence and mixed realityBadeja, D., Schier, F., McGinity, M. & Hoyer, J., 8 Apr 2025Research output: Contribution to conferences > Poster
• Energy-Efficient Aggressive Duty-Cycling of V-band Power AmplifiersBecker, M. G., Gunia, M., Mendez, D. & Ellinger, F., 7 Apr 2025, In: IEEE access. 13, p. 64638-64652, 15 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Low Temperature Atomic Layer Deposition of (00l)-Oriented Elemental BismuthVazquez-Arce, J. L., Amoroso, A., Perez, N., Charvot, J., Naglav-Hansen, D., Zhao, P., Yang, J. & 10 others, 7 Apr 2025, In: Angewandte Chemie - International Edition. 64, 15, 13 p., e202422578Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Rapid Thermal Energy Modeling and Analysis of Complex Industrial Hydraulic SystemsAl-Issa, A., Schulze, T. & Weber, J., 6 Apr 2025, In: International Journal of Fluid Power. 26, 01, p. 65-98, 34 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article