Publications

2026

• From models to impact: a human-AI approach for effective support of collaborative teams in agile product developmentOgnevoj, R., Musawi, A., Bugueno, M., Busch, M., Batora, M., Ritzer, K., Bursac, N. & 1 others, 2026, In: Proceedings of the Design Society. 6, DESIGN 2026, p. 267-276, 10 p.Electronic (full-text) versionResearch output: Contribution to journal > Conference article
• From Networks to Architectures: Trustworthy AI Models for Medical ApplicationsSchmidt, M., 2026, Encyclopedia of Exercise Medicine in Health and Disease. Springer, p. 1-7, 7 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Chapter in book/Anthology/Report
• From Pilot to Practice: Business Model Innovation for 5G-Enabled Bidirectional Charging in Smart CitiesWang, S., del Rio Carazo, L. & Fitzek, F. H., 2026, Proceedings of the 15th International Conference on Smart Cities and Green ICT Systems, SMARTGREENS 2026. Klingert, S., Santini, S., Calise, F. & Klein, C. (eds.). Science and Technology Publications, Lda, p. 111-119, 9 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• From Sensor Data to Knowledge: Advanced Monitoring and Analysis for Next-Gen Fully Automated FabsLaurisch, J. W., Rank, S. & Schmidt, T., 2026, 24th European Advanced Process Control and Manufacturing Conference (apc|m). p. 1-8, 8 p.Research output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• FT-CGRA: Compiler-Transparent Fault Tolerance for CGRAsAliagha, E., Amutha, V. S. M. & Göhringer, D., 2026, p. 117-124, 8 p.Electronic (full-text) versionResearch output: Contribution to conferences > Paper
• Guidance and Control Co-Design for Enhanced Performance of Fixed-Wing UAVsWisbacher, S., Berenguer Bertran, R., Guist, M., Ossmann, D. & Pfifer, H., 2026, In:  IFAC-PapersOnLineElectronic (full-text) versionResearch output: Contribution to journal > Conference article
• High Temperature Shock Testing on QFN, Flip-Chip and Chip Resistor Solder InterconnectsHäusler, M., Meier, K. & Bock, K., 2026, Proceedings - 2026 IEEE 76th Electronic Components and Technology Conference, ECTC 2026. Institute of Electrical and Electronics Engineers (IEEE), p. 265-270, 6 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Human–machine interface and anticipatory interactionGüleçyüz, B., Singh, H., Hulin, T., Wu, Y., Nockenberg, L., Kührt, C., Krug, K. & 2 others, 2026, Humans, Robots, and Virtual Worlds in the Tactile Internet. Elsevier Academic Press Inc, p. 189-205, 17 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Chapter in book/Anthology/Report
• Human skills and learningAssila, N., Kührt, C., Fairhurst, M., Limanowski, J. & Narciss, S., 2026, Humans, Robots, and Virtual Worlds in the Tactile Internet. Elsevier Academic Press Inc, p. 99-114, 16 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Chapter in book/Anthology/Report
• Hybrid fault diagnosis in the process and chemical industries: A reviewEydam, L., Lange, H. & Urbas, L., 2026, In: Annual Reviews in Control. 62, 101064Electronic (full-text) versionResearch output: Contribution to journal > Review article