Publications

2020

• Development of a novel TIG hot-wire process for wire and arc additive manufacturingSpaniol, E., Ungethüm, T., Trautmann, M., Andrusch, K., Hertel, M. & Füssel, U., 1 Aug 2020, In: Welding in the world. 64, 8, p. 1329-1340, 12 p.Electronic (full-text) versionResearch output: Contribution to journal > Conference article
• Investigation on the formation of grain boundary serrations in additively manufactured superalloy Haynes 230Haack, M., Kuczyk, M., Seidel, A., López, E., Brückner, F. & Leyens, C., 1 Aug 2020, In: Journal of laser applications. 32, 3, 032014Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Involvement of Unsaturated Switching in the Endurance Cycling of Si-doped HfO₂ Ferroelectric Thin FilmsLi, S., Zhou, D., Shi, Z., Hoffmann, M., Mikolajick, T. & Schroeder, U., 1 Aug 2020, In: Advanced electronic materials. 6, 8, 2000264Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Memory technology—a primer for material scientistsSchenk, T., Pešić, M., Slesazeck, S., Schroeder, U. & Mikolajick, T., 1 Aug 2020, In: Reports on progress in physics. 83, 8, 086501Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Potential and challenges of additive manufacturing for topology optimized spacecraft structuresWillner, R., Lender, S., Ihl, A., Wilsnack, C., Gruber, S., Brandão, A., Pambaguian, L. & 4 others, 1 Aug 2020, In: Journal of laser applications. 32, 3, 032012Electronic (full-text) versionResearch output: Contribution to journal > Research article
• RESURF n-LDMOS Transistor for Advanced Integrated Circuits in 4H-SiCWeiße, J., Matthus, C., Schlichting, H., Mitlehner, H. & Erlbacher, T., 1 Aug 2020, In: IEEE transactions on electron devices : ED. 67, 8, p. 3278-3284, 7 p., 9132665Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Stable Matching for Wireless URLLC in Multi-Cellular, Multi-User SystemsHößler, T., Schulz, P., Jorswieck, E. A., Simsek, M. & Fettweis, G. P., 1 Aug 2020, In: IEEE Transactions on Communications. 68, 8, p. 5228-5241, 14 p., 9096559Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Strengthening of Titanium by Equal Channel Angular Pressing - Impact on Oxide Layer Properties of Pure Titanium and Ti6Al4VFranz, M., Mingler, B., Krystian, M., Sajti, L., Pohl, D., Rellinghaus, B., Wolf-Brandstetter, C. & 1 others, 1 Aug 2020, In: Advanced materials interfaces. 7, 16Electronic (full-text) versionResearch output: Contribution to journal > Research article
• A 0.35 mW 70 GHz Divide-by-4 TSPC Frequency Divider on 22 nm FD-SOI CMOS TechnologyTibenszky, Z., Carta, C. & Ellinger, F., Aug 2020, 2020 IEEE Radio Frequency Integrated Circuits Symposium (RFIC). p. 243-246, 4 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• A 3-Bit DAC with gray coding for 100-Gbit/s PAM signal generationRiess, V., Starke, P., Khafaji, M. M., Carta, C. & Ellinger, F., Aug 2020, IMS 2020 - 2020 IEEE/MTT-S International Microwave Symposium. Institute of Electrical and Electronics Engineers (IEEE), p. 201-204, 4 p., 9224093Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution