Publications

2020

• The Effect of Low Temperature Conditions on Vibration Durability of SAC105 InterconnectsOchmann, M., Leslie, D., Meier, K., Dasgupta, A. & Bock, K., Jul 2020, 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2020. Institute of Electrical and Electronics Engineers (IEEE), 9152668Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• The german-speaking twitter community reference data setPflugmacher, J., Escher, S., Reubold, J. & Strufe, T., Jul 2020, IEEE INFOCOM 2020 - IEEE Conference on Computer Communications Workshops, INFOCOM WKSHPS 2020. Institute of Electrical and Electronics Engineers (IEEE), p. 1172-1177, 6 p., 9162728Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Top-Down Fabricated Reconfigurable FET With Two Symmetric and High-Current On-StatesSimon, M., Liang, B., Fischer, D., Knaut, M., Tahn, A., Mikolajick, T. & Weber, W. M., Jul 2020, In: IEEE electron device letters. 41, 7, p. 1110 - 1113, 4 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Toward an ICT-Based Service Oriented Health Care ParadigmAntonopoulos, C. P., Keramidas, G., Voros, N. S., Huebner, M., Schwiegelshohn, F., Goehringer, D., Dagioglou, M. & 3 others, Jul 2020, In: IEEE Consumer Electronics Magazine. 9, 4, p. 77-82, 6 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Anisotropic Exclusion Effect between Photocatalytic Ag/AgCl Janus Particles and Passive Beads in a Dense Colloidal MatrixHuang, T., Gobeil, S., Wang, X., Misko, V., Nori, F., De Malsche, W., Fassbender, J. & 3 others, 30 Jun 2020, In: Langmuir. 36, 25, p. 7091-7099, 9 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Electro-optical co-integration of chip-components in optical transceivers for optical inter-chip communicationNieweglowski, K., Lorenz, L., Bock, K., Catuneanu, M. & Jamshidi, K., 30 Jun 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC). Institute of Electrical and Electronics Engineers (IEEE), p. 139-147, 9 p., 9159256Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Low Temperature Vibration Reliability of Lead-free Solder JointsMeier, K., Ochmann, M., Bock, K., Leslie, D. & Dasgupta, A., 30 Jun 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC). Institute of Electrical and Electronics Engineers (IEEE), p. 801-806, 6 p., 9159478Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Nearly zero energy renovation concepts for apartment buildingsKuusk, K., Naumann, J., Gritzki, A., Felsmann, C., De Carli, M., Tonon, M. & Kurnitski, J., 30 Jun 2020, In: E3S Web of Conferences. 172, 18009Electronic (full-text) versionResearch output: Contribution to journal > Conference article
• Techniques and Methodologies for Measuring and Increasing the Quality of Services: a Case Study Based on Data CentersZinner, M., Feldhoff, K., Kluge, M., Jurenz, M., Markwardt, U., Sprenger, D., Mickler, H. & 3 others, 30 Jun 2020, In: International Journal on Advances in Intelligent Systems. 13, 1&2, p. 19-35, 17 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Miniature hydraulics for a mechatronic lower limb prosthesisWaurich, V., Stentzel, C. & Will, F., 26 Jun 2020, Volume 3 - ConferenceElectronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution