Publications

2020

• Adjustment of uncertain model parameters to improve the prediction of the thermal behavior of machine toolsIhlenfeldt, S., Schroeder, S., Penter, L., Hellmich, A. & Kauschinger, B., May 2020, In: CIRP annalsElectronic (full-text) versionResearch output: Contribution to journal > Research article
• An experimental study of tongue body loops in V1-V2-V1 sequencesThiele, C., Mooshammer, C., Belz, M., Rasskazova, O. & Birkholz, P., May 2020, In: Journal of Phonetics. 80, 100965Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Breaking and (partially) fixing provably secure onion routingKuhn, C., Beck, M. & Strufe, T., May 2020, Proceedings - 2020 IEEE Symposium on Security and Privacy, SP 2020. Institute of Electrical and Electronics Engineers (IEEE), p. 168-185, 18 p., 9152635Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Browsing unicity: On the limits of anonymizing web tracking dataDeußer, C., Passmann, S. & Strufe, T., May 2020, Proceedings - 2020 IEEE Symposium on Security and Privacy, SP 2020. Institute of Electrical and Electronics Engineers (IEEE), p. 777-790, 14 p., 9152774Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Characteristics of granulates used as core materials in the overmoulding process of hollow profilesLiebsch, A., Kupfer, R., Hornig, A. & Gude, M., May 2020, In: Journal of Materials Processing Technology. 279, 116579Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Continuous electron-induced reactive processing – A sustainable reactive processing method for polymersZschech, C., Pech, M., Müller, M., Wießner, S., Wagenknecht, U. & Gohs, U., May 2020, In: Radiation Physics and Chemistry. 170, 108652Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Deposition Technologies for Electronic Systems Based on Ultra-Thin GlassKnoch, P., Meier, K., Luniak, M. & Bock, K., May 2020, 2020 43rd International Spring Seminar on Electronics Technology (ISSE). IEEE Computer Society, 6 p., 9120907Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Development of a highly productive GMAW hot wire process using a two-dimensional arc deflectionSpaniol, E., Trautmann, M., Ungethüm, T., Hertel, M., Fuessel, U., Henckell, P. & Bergmann, J. P., May 2020, In: Welding in the world. 64, 5, p. 873-883, 11 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Direct Chip-To-Waveguide Transition Realized with Wire Bonding for 140-220 GHz G-BandStarke, P., Carta, C. & Ellinger, F., May 2020, In: IEEE transactions on terahertz science and technology. 10, 3, p. 302-308, 7 p., 8984241Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Endurance and targeted programming behavior of HfO2-FeFETsZhou, H., Mennenga, J. O. M., Müller, M. N. S., Müller, M. N. S., Trentzsch, M., Trentzsch, M., Beyer, S. D. S. & 1 others, May 2020, 2020 IEEE International Memory Workshop (IMW). Dresden: Institute of Electrical and Electronics Engineers (IEEE), 9108131Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution