2018

• Diversification of Device Platforms by Molecular Layers: Hybrid Sensing Platforms, Monolayer Doping, and ModelingYitzchaik, S., Gutierrez, R., Cuniberti, G. & Yerushalmi, R., 27 Nov 2018, In: Langmuir. 34, 47, p. 14103-14123, 21 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Experimental studies of two-phase liquid metal-gas chain flow with ultrasonic echo pulse method and in the magnetic field of permanent magnetsAndruszkiewicz, A. & Eckert, K., 27 Nov 2018, In: MATEC Web of Conferences. 240, 03003Electronic (full-text) versionResearch output: Contribution to journal > Conference article
• Meander designer: Automatically generating meander channel designsGrimmer, A., Frank, P., Ebner, P., Häfner, S., Richter, A. & Wille, R., 27 Nov 2018, In: Micromachines. p. 625Research output: Contribution to journal > Research article
• Evaluation of Nanoparticle Inks on Flexible and Stretchable Substrates for Biocompatible ApplicationSchubert, M., Rebohle, L., Wang, Y., Fritsch, M., Bock, K., Vinnichenko, M. & Schumann, T., 26 Nov 2018, 2018 7th Electronic System-Integration Technology Conference (ESTC). Dresden: IEEE Xplore, 8546494Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Reliability of 3D additive manufactured packagesLungen, S., Tiedje, T., Meier, K., Nieweglowski, K. & Bock, K., 26 Nov 2018, 2018 7th Electronic System-Integration Technology Conference (ESTC). Dresden: IEEE Xplore, 8546417Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Will 3D-semiadditive packaging with high conductive redistribution layer and process temperatures below 100°C enable new electronic applications?Tiedje, T., Lungen, S., Nieweglowski, K. & Bock, K., 26 Nov 2018, 2018 7th Electronic System-Integration Technology Conference (ESTC). Dresden: IEEE Xplore, 8546450Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Wire Bonding of Surface Acoustic Wave (SAW) Sensors for High Temperature ApplicationsErnst, D., Brachmann, E., Menzel, S. & Bock, K., 26 Nov 2018, 2018 7th Electronic System-Integration Technology Conference (ESTC). Dresden: IEEE Xplore, 8546491Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• A combination of multi-fluid mixture models with COSMO-SACJäger, A., Mickoleit, E. & Breitkopf, C., 25 Nov 2018, In: Fluid phase equilibria. 476, p. 147-156, 10 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Green coloring of GaN single crystals introduced by Cr impurityZimmermann, F., Gärtner, G., Sträter, H., Röder, C., Barchuk, M., Bastin, D., Hofmann, P. & 4 others, 24 Nov 2018, In: Journal of luminescence. 207, p. 507-511, 5 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Bruchmechanische Kennwertermittlung an textilverstärkten KunststoffenKuhtz, M., Hornig, A., Weber, T., Modler, N. & Gude, M., 23 Nov 2018Research output: Contribution to conferences > Presentation slides