Publications

2019

• On-water surface synthesis of crystalline, few-layer two-dimensional polymers assisted by surfactant monolayersLiu, K., Qi, H., Dong, R., Shivhare, R., Addicoat, M., Zhang, T., Sahabudeen, H. & 5 others, 1 Nov 2019, In: Nature chemistry. 11, 11, p. 994-1000, 7 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• S-layer protein-AuNP systems for the colorimetric detection of metal and metalloid ions in waterJung, J., Lakatos, M., Bengs, S., Matys, S., Raff, J., Blüher, A. & Cuniberti, G., 1 Nov 2019, In: Colloids and Surfaces B: Biointerfaces. 183, 110284Electronic (full-text) versionResearch output: Contribution to journal > Research article
• A Cost-Effective Flip-Chip Interconnection for Applications from DC until 200 GHzTesta, P. V., Morath, H., Goran, P., Carta, C. & Ellinger, F., Nov 2019, IEEE Asia-Pacific Conference on Applied Electromagnetics (APACE). 6 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Active Single-Ended to Differential Converter (Balun) for DC up to 70 GHz in 130 nm SiGeStarke, P., Rieß, V., Carta, C. & Ellinger, F., Nov 2019, 2019 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium, BCICTS 2019. Institute of Electrical and Electronics Engineers (IEEE), 8972713Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Adoption of 2T2C ferroelectric memory cells for logic operationRavsher, T., Mulaosmanovic, H., Breyer, E. T., Havel, V., Mikolajick, T. & Slesazeck, S., Nov 2019, 2020 27th IEEE International Conference on Electronics, Circuits and Systems (ICECS). Institute of Electrical and Electronics Engineers (IEEE), p. 791-794, 4 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Advances in the melt spinning of bicomponent fibres (Poster P97)Tran, N. H. A., Hund, R., Häntzsche, E., Le Xuan, H., Brüning, H. & Cherif, C., Nov 2019, p. 278, 1 p.Research output: Contribution to conferences > Poster
• A new stitching technology for improved thermal insulation of 3D nonwoven assemblies (Poster P84)Saeed, H., Rödel, H., Krzywinski, S. & Hes, L., Nov 2019, p. 262, 1 p.Research output: Contribution to conferences > Poster
• Application of μcT for the determination of total surface area of stentsSaqib, M., Bernhardt, R., Kastner, M., Beshchasna, N., Cuniberti, G. & Opitz, J., Nov 2019, 2019 E-Health and Bioengineering Conference (EHB). Iasi: Institute of Electrical and Electronics Engineers (IEEE), 8969971Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Clinchen von Kupferwerkstoffen zur Kontaktierung elektrischer LeiterKalich, J., Schlegel, S., Füssel, U. & Großmann, S., Nov 2019, In: Metall. 73, 11, p. 456-459, 4 p.Research output: Contribution to journal > Research article
• C₆₀ fullerene as an effective nanoplatform of alkaloid berberine delivery into leukemic cellsGrebinyk, A., Prylutska, S., Buchelnikov, A., Tverdokhleb, N., Grebinyk, S., Evstigneev, M., Matyshevska, O. & 7 others, Nov 2019, In: Pharmaceutics. 11, 11, 586Electronic (full-text) versionResearch output: Contribution to journal > Research article