Publications

2019

• Bounds on Phase and Frequency Estimation from 1-bit Quantized Signals with Phase DitheringSchlüter, M., Dörpinghaus, M. & Fettweis, G., May 2019, IEEE International Conference on Communications (ICC). Shanghai, ChinaElectronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Combined Optimal Topology Formation and Rate Allocation for Aircraft to Aircraft CommunicationsHofmann, S., Megas, V., Ozger, M., Schupke, D., Fitzek, F. H. & Cavdar, C., May 2019, 2019 IEEE International Conference on Communications, ICC 2019 - Proceedings. Institute of Electrical and Electronics Engineers (IEEE), 8761882Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Connectivity in the Air: Throughput Analysis of Air-to-Ground SystemsHofmann, S., Garcia, A. E., Schupke, D., Gonzalez, H. E. & Fitzek, F. H., May 2019, 2019 IEEE International Conference on Communications, ICC 2019 - Proceedings. Institute of Electrical and Electronics Engineers (IEEE), 8761108Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Copulas and Multi-user Channel OrdersLin, P., Jorswieck, E. A., Schaefer, R. F., Janda, C. R. & Mittelbach, M., May 2019, ICC 2019 - 2019 IEEE International Conference on Communications (ICC). Shanghai, p. 1-6Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Development of a new hybrid yarn construction from recycled carbon fibres for high-performance composites. Part III: Influence of sizing on textile processing and composite properties.Hengstermann, M., Hasan, M. M. B., Scheffler, C., Abdkader, A. & Cherif, C., May 2019, In:  Journal of Thermoplastic Composite Materials. 34, 3, p. 409-430, 22 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Digitale Prozesskette: Vom CAD-Entwurf zur fertigen 3D-PreformGereke, T., Döbrich, O., Hübner, O., Sennewald, C., Hoffmann, G., Nocke, A. & Cherif, C., May 2019, In:  Jahresbericht des Institutes für Textilmaschinen und Textile Hochleistungswerkstofftechnik der TU Dresden. p. 14-17, 4 p.Research output: Contribution to journal > Research article
• Evaluating Automated Guided Vehicle System Characteristics in Semiconductor Fab Automated Material Handling SystemsReith, K., Boden, P., Däumler, M., Rank, S., Schmidt, T. & Hupfer, R., May 2019, 2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC). Institute of Electrical and Electronics Engineers (IEEE), 6 p., 8791758Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Impact of Warpage Effects on Quality and Reliability of Solder JointsAlbrecht, O., Meier, K. & Wohlrabe, H., May 2019Electronic (full-text) versionResearch output: Contribution to conferences > Paper
• Influence of gas atmosphere on electron-induced reactions of polyacrylonitrile homopolymer powder at elevated temperatureGohs, U., Böhm, R., Brünig, H., Fischer, D., Leopold, A., Malanin, M., Müller, M. & 4 others, May 2019, In: Radiation Physics and Chemistry. 158, p. 94-102, 9 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Modelling and simulation of the particle focusing behavior in microfluidic channels – effects of curvature and aspect ratioHafemann, T. E., Rodriguez, J., Arango, F., Fröhlich, J. & Ruis-Salguero, O., May 2019Research output: Contribution to conferences > Paper