Publications
The Research Portal (FIS) of TU Dresden provides a detailed search for publications in the School of Engineering Sciences.
20633 Entries
2025
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In-Network Computing for Object Recognition in XR Applications, 2025, 2025 IEEE 22nd Consumer Communications and Networking Conference, CCNC 2025. Institute of Electrical and Electronics Engineers (IEEE)Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Internal Model Control for Minimum and Maximum Phase Nonlinear Systems, 2025, 2025 26th International Carpathian Control Conference (ICCC). Kacur, J., Skovranek, T., Laciak, M. & Mojzisova, A. (eds.). Institute of Electrical and Electronics Engineers (IEEE), p. 1-6Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Introducing GPTKB to the Semantic Web, 2025, ISWC-C 2025 Industry, Doctoral Consortium, Posters and Demos at ISWC 2025 : Joint Proceedings of Industry, Doctoral Consortium, Posters and Demos of the 24th International Semantic Web Conference (ISWC-C 2025). p. 363-368Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Investigating the Robustness of Dynamically Tunable Logic Gates with Tantalum Oxide Memristors, 2025, ISCAS 2025 - IEEE International Symposium on Circuits and Systems, Proceedings. Institute of Electrical and Electronics Engineers (IEEE), p. 1-5Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Investigation of Ash Deposition Behaviour from Biogenic Solid Fuel under Gas Turbine Conditions with Film Cooling, 2025, 18 p.Electronic (full-text) versionResearch output: Contribution to conferences > Paper
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Isokinetische Teilstromentnahme zur Schweißrauchmessung, 2025, 45. Assistentenseminar Füge- und Schweißtechnik. Düsseldorf: DVS Media GmbH, p. 36-44, 9 p.Research output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Isothermal Shock Testing on Flip-Chip Interconnects, 2025, Proceedings - IEEE 75th Electronic Components and Technology Conference, ECTC 2025. Institute of Electrical and Electronics Engineers (IEEE), p. 737-742, 6 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Key Exchange in the Quantum Era: Evaluating a Hybrid System of Public-Key Cryptography and Physical-Layer Security, 2025, 2025 59th Annual Conference on Information Sciences and Systems, CISS 2025. Institute of Electrical and Electronics Engineers (IEEE), 6 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Kondensatorentladungsschweißen von Kupfer- und Kupfer-Mischbauteilen für Anwendungen in der Energiewende, 2025, Kupfer-Symposium 2025: 12. bis 13. November 2025, Werkstofftagung in Schwäbisch GmündResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Kontinuierliche Optimierung der Prozessparameter für Bohrgeräte beim Setzen von Bohrankern, 2025, 24. Kolloquium Bohr- und Sprengtechnisches Kolloquium: Tagungsband. Langefeld, O. & Tudeshki, H. (eds.).p. 99 - 109Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution