Plasma-assisted CVD procedure at atmospheric pressure
By the help of plasma CVD processes (AP-PECVD) it is possible to deposit large areas on high quality functional films without using expensive vacuum systems. Thus we can realize a continuous coating with high rates on temperature-sensitive materials, such as special steels, light metal, glasses and polymers as well as on bended substrates with different thicknesses.
We develop prototypes of AP-PECVD inline reactors with gas locks for the production of oxide and non-oxide films at normal pressure. Basing on experimental results and thermo-fluidic dynamical simulations the reactor design could be optimized. The modular reactor design enables an economical process adaptation to new fields and film materials.
Contact:
Dr. Ines Dani
Phone: +49 351 463 31993