Aug 16, 2023
DigiTain project meeting

Group photo of the participants
Successful first steps for fully digital product development of sustainable electric drive architectures
The research project DigiTain (Digitization for Sustainability) for fully digital product development of sustainable electric drive architectures is in high gear.
After the kick-off meeting in Stuttgart on January 31, 2023, about 100 participants of the consortium met on July 6, mostly on site in Dresden at the project partner Institute for Lightweight Construction and Plastics Technology (ILK) of the Technical University of Dresden, but also partly virtually. Opened by Dr. Norbert Dölle (Mercedes-Benz, project coordinator) and Prof. Niels Modler (ILK TU Dresden, host & project partner), the focus was on the current status of the work packages as well as the report of the first goals achieved by the WP leaders. In addition, the project partners had the opportunity to coordinate and discuss in workshops on the days surrounding the project meeting. Here, the further research work and interfaces could be deepened, and the next steps planned, so that exciting interim results can be expected at the next DigiTain project meeting in January 2024 at the Fraunhofer Institutes EMI and IWM in Freiburg.
The Chair of Virtual Product Development is working closely with the ILK in the DigiTain research project in work packages 1 and 2. In WP1, a sustainability-oriented product development process (NEP) is being developed. The aim is to enable the optimization of the life cycle assessment at component and overall vehicle level during the product development process. In WP2, the documentation and traceability of calculation process chains for a more predictive CAE modeling and validation of vehicle components is investigated. Here the focus lies on the recording of relevant intermediate results and optimization steps in PDM/PLM systems. The Dresden project partner XPLM Solution GmbH is involved in the project with the necessary programming implementation and integration of new interfaces.