Jul 06, 2026
TSMC, ESMC and TU Dresden Deepen Strategic Cooperation and Talent Development
Prof. Angela Rösen-Wolff, Vice-Rector Research and Technology Transfer, Charlie Chiang, Deputy Director ESMC Fab, Clark Chen, Deputy Director TSMC University Program, Dr. Christian Koitzsch, President ESMC, Prof. Ursula M. Staudinger, Rector TUD, Prof. Roswitha Böhm, Vice-Rector University Culture and Internationalization and Prof. Niels Modler, Vice-Rector Academic Affairs Across the Life Course. (from left)
Collaborative research focused on next-generation automotive and industrial applications, ensuring the Dresden ecosystem remains at the forefront of European chip design and manufacturing, with greater international visibility and attractiveness for the region as a semiconductor hub: these are the goals set out by the partners in a Memorandum of Understanding (MoU) signed on June 4, 2026. In doing so, the world's largest semiconductor manufacturer TSMC, European Semiconductor Manufacturing (ESMC) GmbH, and Dresden University of technology (TUD) are deepening their cooperation and strengthening the Dresden site as Europe's largest semiconductor cluster.
Representatives of the world's largest semiconductor manufacturer Taiwan Semiconductor Manufacturing Company Limited (TSMC), ESMC in Dresden, the TUD Executive Board, as well as the TUD Excellence Center for Innovation, Transfer and Entrepreneurship (TUD|excite) met at TUD on June 4, 2026. The objective was to define the partners' future strategic cooperation.
Dr. Christian Koitzsch and Prof. Ursula M. Staudinger sign the memorandum of understanding.
In their Memorandum of Understanding, the partners specified joint research projects and the development of joint teaching and recruitment programs extending beyond the already highly successful STIPT program. TUD is to administer these joint measures. TSMC and TUD have been cooperating on talent development through the Semiconductor Talent Incubation Program (STIPT) since 2024. This program allows students to complete a six-month semester abroad in Taiwan. With the signing of this latest declaration, the partners are further expanding their collaboration.
Marvin Chang, Director, University Programs and Design Solutions, TSMC: "This MoU strengthens our commitment to talent incubation for the industry and helps establish a collaborative framework for high-level semiconductor research. By aligning TU Dresden’s academic excellence with our technology leadership, we are demonstrating how industry and academia can jointly solve the most complex scaling and design challenges."
Christian Koitzsch, President, ESMC: "With our efforts to advance educational programs and development projects we contribute to Dresden being a leader in European microelectronics. Our focus lies on building the talent pipeline and infrastructure that supports the long-term development of EU key industries."
Prof. Ursula M. Staudinger, Rector of TUD: "As a University of Excellence with a strong profile in microelectronics, chip design, and data-intensive technologies, we are working with TSMC to make a significant contribution to training the skilled professionals urgently needed by Germany as a semiconductor location. To ensure that will remain the case in the future, we are now taking the next step in our partnership with this Memorandum of Understanding. This secures a strong collaboration that enables innovation in semiconductor research. It is another important step on the path to developing Dresden into a European center for future technologies."
Background: STIPT Program
The Semiconductor Talent Incubation Program Taiwan (STIPT) enables STEM students to combine a six-month semester abroad in Taiwan with exclusive practical training at TSMC. Each year, 100 places in the exchange program are awarded to interested applicants. Of these, 60 are reserved for students from Saxon universities, while 40 are designated for students from other German federal states. TUD administers the program on behalf of the Saxon State Ministry for Science, Culture and Tourism and, together with the Saxon Science Liaison Office Taiwan, organizes the exchange with partner universities and TSMC in Taiwan. STIPT is funded by the Federal Ministry for Research, Technology and Space (BMFTR) and the Saxon State Ministry for Science, Culture and Tourism (SMWK).
More information: https://tu-dresden.de/studium/im-studium/auslandsaufenthalt/programme-und-foerdermoeglichkeiten/semiconductor-talent-incubation-program
Background: TUD|excite
The Excellence Center for Innovation, Transfer and Entrepreneurship (TUD|excite) is an interdisciplinary institution at TUD. It brings together key areas of activity under one roof: the management of patents and other intellectual property rights, support for research-based innovation projects on their way to application, strategic partnerships with companies, support for spin-offs, and education and training in transfer-related topics. More information: https://tu-dresden.de/forschung-transfer/transfer/tud-excite
Contact
Hans-Georg Wagner
Head of Unit excite|INNOVATE
+49 351 463-39774