Jens Wagner
© Jens Wagner
Group leader
NameDr.-Ing. Jens Wagner
Group RFIC Frontend design
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Chair for Circuit Design and Network Theory
Visitor address:
Barkhausenbau, Room: 130 Helmholtzstraße 18
01069 Dresden
None
Teaching
- Paper and lab tutorials for Radio Frequency Integrated circuits
2024
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A 60GHz Cross-Coupled Transformer-Based Quadrature-Phase Coupler in 22nm FD-SOI, 2024, 2024 19th European Microwave Integrated Circuits Conference, EuMIC 2024. Institute of Electrical and Electronics Engineers (IEEE), p. 395-398, 4 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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A Class-J/F 60 GHz Power Amplifier with 42.3% Power Added Efficiency in FDSOI CMOS, 2024, 2024 IEEE Radio Frequency Integrated Circuits Symposium, RFIC 2024. Institute of Electrical and Electronics Engineers (IEEE), p. 123-126, 4 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Green Circular Economy Design Aspects for 6G Wireless Millimeter-Wave Transceivers, 2024, 4th URSI Atlantic Radio Science Meeting (AT-RASC) 2024. Institute of Electrical and Electronics Engineers (IEEE)Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
2023
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Analysis of a Switched Passive Input Network Based on a Surface Acoustic Wave Resonator for 433 MHz Wakeup Receivers, 9 Nov 2023, 2023 SBMO/IEEE MTT-S International Microwave and Optoelectronics Conference (IMOC). Institute of Electrical and Electronics Engineers (IEEE), p. 148-150, 3 p., 10379776Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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A 433MHz OOK Wake-up Transmitter with Integrated Inverse Class E in 22 nm FD-SOI, 19 Sep 2023, 2023 18th European Microwave Integrated Circuits Conference (EuMIC). Institute of Electrical and Electronics Engineers (IEEE), p. 229-232, 4 p., 10289092Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Characterization of Embedded and Thinned RF Chips, 14 Sep 2023, 24th European Microelectronics and Packaging Conference, EMPC 2023. Institute of Electrical and Electronics Engineers (IEEE), p. 1-6, 6 p., 10418325Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Entrainment of Mutually Synchronized Spatially Distributed 24 GHz Oscillators, Jul 2023, In: IEEE Transactions on Circuits and Systems : a publication of the IEEE Circuits and Systems Society. 1, Regular Papers. 70, 7, p. 2665-2678, 14 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
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A 28 GHz and 38 GHz Dual-Band Up-Conversion Mixer for 5G Applications in 22 nm FD-SOI CMOS, 18 Jun 2023, PRIME 2023 - 18th International Conference on Ph.D Research in Microelectronics and Electronics, Proceedings. p. 141-144, 4 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Design and Experimental Evaluation of 60 GHz Self-compensating Bond-wire Interconnect, Jun 2023, 21st IEEE Interregional NEWCAS Conference, NEWCAS 2023 - Proceedings. Institute of Electrical and Electronics Engineers (IEEE), 5 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Heterogeneity in Time Delays between Mutually Synchronized 24 GHz Oscillators, Jun 2023, 21st IEEE Interregional NEWCAS Conference, NEWCAS 2023 - Proceedings. 5 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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