Helmuth Morath

2022

• Tactile electronics meets softwarised networksWagner, J., Morath, H. P. E., Zhang, J., Wieczorek, F., Lüneburg, L., Fitzek, F. H. P. & Nguyen, G. T., 10 Jan 2022, 2022 IEEE 19th Annual Consumer Communications & Networking Conference (CCNC). p. 961-962, 2 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution

2021

• 19 Gbps 60GHz CMOS OOK demodulator with 0.3 pJ/bit based on asymmetric invertersMorath, H. P. E., Cui, M., Testa, P. V., Wagner, J. & Ellinger, F., 1 Dec 2021, Proceedings of the IEEE Asia-Pacific Microwave Conference (APMC). p. 296-298, 3 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Designing a 60 GHz Sub-Milliwatt Transceiver for Wireless Body-Area-NetworksMorath, H. P. E., An, X., Wagner, J., Testa, P. V., Bock, K. & Ellinger, F., 12 Nov 2021, 26th European Wireless Conference, EW 2021. VDE Verlag, Berlin [u. a.], p. 112-117, 6 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• A 3.6 mW 60 GHz Low-Noise Amplifier With 0.6 ns Settling Time for Duty-Cycled ReceiversMorath, H. P. E., Testa, P. V., Wagner, J. & Ellinger, F., Aug 2021, In: IEEE Microwave and Wireless Component Letters. 31, 8, p. 977–980, 4 p., 9438695Electronic (full-text) versionResearch output: Contribution to journal > Research article

2019

• A Cost-Effective Flip-Chip Interconnection for Applications from DC until 200 GHzTesta, P. V., Morath, H., Goran, P., Carta, C. & Ellinger, F., Nov 2019, IEEE Asia-Pacific Conference on Applied Electromagnetics (APACE). 6 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution