Tobias Kock
© TUDresden
Research Assistant
NameMr Tobias Kock M.Sc.
Modular Plant Operations Group
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Process Systems Engineering Group
Process Systems Engineering Group
Visiting address:
Merkelbau, MER E12 Helmholtzstraße 14
01069 Dresden
Office hours:
by appointment
Research Interests
- Modular Automation
- PEA-Engineering
- Module-Type-Package (MTP)
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Combination of Process and Automation engineering in Modular Plants
Short Biography
| seit 2022 | Scientific Employee TU Dresden - Chair of Process Control Systems |
| 2020-2022 | Student Assistant
TU Dortmund- Group Equipment Design |
| 2018-2019 | Technical Employee - Bayer |
| 2018 bis 2019 | Internship- Bayer |
| 2015 bis 2022 | Study of Chemical engineering at TU Dortmund |
Publications
2025
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Design und Erprobung einer Infrastruktur für modulare Prozessanlagen: Praxisbericht aus dem P2O-Lab der TU Dresden, 29 Apr 2025, In: atp magazin. 67, 4, p. 70-77, 8 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
2024
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A Mapping Approach from System Control Diagrams to the Module Type Package, 2024, 2024 IEEE 29th International Conference on Emerging Technologies and Factory Automation, ETFA 2024. Facchinetti, T., Cenedese, A., Bello, L. L., Vitturi, S., Sauter, T. & Tramarin, F. (eds.). Institute of Electrical and Electronics Engineers (IEEE)Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Effiziente Integration von Elektrolyseuren in modularen Elektrolyseanlagen: einheitliche Schnittstellen zur Wasserstofferzeugung, 2024, EKA 2024 - Entwurf komplexer Automatisierungssysteme, 18. Fachtagung. Magdeburg: Otto von Guericke University Library, 10 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
2023
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Process Control Principles for Scalable Electrolysis Systems, 15 Sep 2023, 2023 IEEE 28th International Conference on Emerging Technologies and Factory Automation (ETFA). Institute of Electrical and Electronics Engineers (IEEE), p. 1-4, 4 p., 10275330Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Transformation of process functions to the Module Type Package utilizing System Control Diagrams, 15 Sep 2023, 2023 IEEE 28th International Conference on Emerging Technologies and Factory Automation (ETFA). Institute of Electrical and Electronics Engineers (IEEE), p. 1-4, 4 p., 10275331Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Artificial Intelligence-based Module Type Package-compatible Smart Sensors in the Process Industry, 9 Aug 2023, In: Chemie Ingenieur Technik. 95 (2023), 10, p. 1546-1554, 9 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
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Separation of Crotonic Acid and 2-Pentenoic Acid Obtained by Pyrolysis of Bio-Based Polyhydroxyalkanoates Using a Spinning Band Distillation Column, 27 Mar 2023, In: ACS Sustainable Chemistry Engineering. 11, 12, p. 4699-4706, 8 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
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Flexible Process Control for Scalable Electrolysis Systems, 2023, 2023 IEEE 3th International Conference on Electrical, Computer and Energy Technologies (ICECET). p. 680-685Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Standards for Information Models Considering Knowledge Distribution in Modular Plants, 2023, 2023 IEEE 21st International Conference on Industrial Informatics, INDIN 2023. Dorksen, H., Scanzio, S., Jasperneite, J., Wisniewski, L., Man, K. F., Sauter, T., Seno, L., Trsek, H. & Vyatkin, V. (eds.). Institute of Electrical and Electronics Engineers (IEEE), p. 1-7Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
2022
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MTPPy: Open-Source AI-friendly Modular Automation, 9 Sep 2022, 2022 IEEE 27th International Conference on Emerging Technologies and Factory Automation (ETFA). IEEE Computational Intelligence Society (CIS), p. 1-7, 7 p., 9921713Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution