Tobias Kock

2025

• Design und Erprobung einer Infrastruktur für modulare Prozessanlagen: Praxisbericht aus dem P2O-Lab der TU DresdenKlose, A., Khaydarov, V., Kock, T., Mädler, J., Lange, H., Lorenz, J., Viedt, I. & 1 others, 29 Apr 2025, In: atp magazin. 67, 4Electronic (full-text) versionResearch output: Contribution to journal > Research article

2024

• A Mapping Approach from System Control Diagrams to the Module Type PackageKock, T., Lorenz, J., Klose, A., Ingebringsten, I. P., Schüller, A. & Urbas, L., 2024, 2024 IEEE 29th International Conference on Emerging Technologies and Factory Automation, ETFA 2024. Facchinetti, T., Cenedese, A., Bello, L. L., Vitturi, S., Sauter, T. & Tramarin, F. (eds.). Institute of Electrical and Electronics Engineers (IEEE)Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Effiziente Integration von Elektrolyseuren in modularen Elektrolyseanlagen: einheitliche Schnittstellen zur WasserstofferzeugungLorenz, J., Kock, T., Grahl, L., Henkel, V., Scholz, L., Stark, K., Lorenz, R. & 2 others, 2024, EKA 2024 - Entwurf komplexer Automatisierungssysteme, 18. Fachtagung. Magdeburg: Otto von Guericke University Library, 10 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution

2023

• Process Control Principles for Scalable Electrolysis SystemsLorenz, J., Klose, A., Lange, H., Kock, T. & Urbas, L., 15 Sep 2023, 2023 IEEE 28th International Conference on Emerging Technologies and Factory Automation (ETFA). Institute of Electrical and Electronics Engineers (IEEE), p. 1-4, 4 p., 10275330Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Transformation of process functions to the Module Type Package utilizing System Control DiagramsKock, T., Klose, A., Ingebringsten, I. P., Bittorf, L., Lorenz, J. & Urbas, L., 15 Sep 2023, 2023 IEEE 28th International Conference on Emerging Technologies and Factory Automation (ETFA). Institute of Electrical and Electronics Engineers (IEEE), p. 1-4, 4 p., 10275331Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Artificial Intelligence-based Module Type Package-compatible Smart Sensors in the Process IndustryNeuendorf, L. M., Khaydarov, V., Schlander, C., Kock, T., Fischer, J., Urbas, L. & Kockmann, N., 9 Aug 2023, In: Chemie Ingenieur Technik. 95 (2023), 10, p. 1546-1554, 9 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Separation of Crotonic Acid and 2-Pentenoic Acid Obtained by Pyrolysis of Bio-Based Polyhydroxyalkanoates Using a Spinning Band Distillation ColumnElhami, V., Neuendorf, L. M., Kock, T., Kockmann, N. & Schuur, B., 27 Mar 2023, In: ACS Sustainable Chemistry Engineering. 11, 12, p. 4699-4706, 8 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Flexible Process Control for Scalable Electrolysis SystemsLorenz, J., Klose, A., Lange, H., Kock, T. & Urbas, L., 2023, 2023 IEEE 3th International Conference on Electrical, Computer and Energy Technologies (ICECET)Research output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Standards for Information Models Considering Knowledge Distribution in Modular PlantsKoch, A., Hamedi, N., Furtner, L., Kock, T., Klose, A. & Madler, J., 2023, 2023 IEEE 21st International Conference on Industrial Informatics, INDIN 2023. Dorksen, H., Scanzio, S., Jasperneite, J., Wisniewski, L., Man, K. F., Sauter, T., Seno, L., Trsek, H. & Vyatkin, V. (eds.). Institute of Electrical and Electronics Engineers (IEEE), p. 1-7Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution

2022

• MTPPy: Open-Source AI-friendly Modular AutomationKhaydarov, V., Neuendorf, L., Kock, T., Kockmann, N. & Urbas, L., 9 Sep 2022, 2022 IEEE 27th International Conference on Emerging Technologies and Factory Automation (ETFA). IEEE Computational Intelligence Society (CIS), p. 1-7, 7 p., 9921713Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution