Publications

21 bis 30 von 284 Einträgen

Killge, S.; Neumann, N.; Plettemeier, D.; Bartha, J.W.: Optical Through-Silicon Vias. In: 3D Stacked Chips - From Emerging Processes to Heterogeneous Systems, I.M. Elfadel, G. Fettweis (eds.) (2016), S. 221–234

Killge, S.; Neumann, V.; Bartha, J.W.: Copper-Based TSV: Interposer. In: 3D Stacked Chips - From Emerging Processes to Heterogeneous Systems, I.M. Elfadel, G. Fettweis (eds.) (2016), S. 9–28

Killge, S.; Charania, S.; Bartha, J.W.: Introduction to Electrical 3D Integration. In: 3D Stacked Chips - From Emerging Processes to Heterogeneous Systems, I.M. Elfadel, G. Fettweis (eds.) (2016), S. 3–7

Killge, S.; Charania, S.; Richter, K.; Bartha, J.W.: Towards the realization of optical interconnets on Si interposer. In: Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2016 IEEE International, 23-26 May 2016 (2016)

Millat, S.; Hoeft, J. T.; Bartha, J.W.: SEM Based Overlay - development of dedicated workflow using new imaging capability on CD-SEM for inline process control within Semiconductor manufacturing environment. In: Conference: 16TH EUROPEAN ADVANCED PROCESS CONTROL AND MANUFACTURING (APC|M) CONFERENCE, At Reutlingen (Stuttgart), GERMANY (2016)

Al-Shadeedi, A.; Liu, S.; Keum, Chang-Min; Kasemann, D.; Hossbach, C.; Bartha, J.W.; Bunge, Scott D; Lüssem, B.: Minority Currents in n-Doped Organic Transistors. In: ACS Appl. Mater. Interfaces, 2016, 8 (47), pp 32432–32439 (2016)

Killge, S.; Junige, M.; Geidel, M.; Neumann, V.; Wenzel, C.; Knaut, M.; Albert, M.; Bartha, J.W.: 3D integration: ALD Ruthenium layers grown on metallic and oxide interfaces for TSV with high aspect ratios – Why blisters? In: MAM 2016 – Materials for advanced metalization : 20th – 23th March 2016, Brussels, Belgium. Brussels, 2016 (2016)

Lupina, G.; Strobel, C.; Junige, M.; Kitzmann, J.; Lukosius, M.; Albert, M.; Bartha, J.W.; Wenger, C.: Dielectric-Graphene and Silicon-Graphene integration for Graphene-Based Devices. In: Graphene 2016 : April 19-22, 2016, Genoa, Italy. Genoa, 2016 (2016)

Junige, M.; Sundqvist, J.: Chemical path to Atomic Layer Etching. In: Novel high-k application workshop 2016. Dresden (2016)

Junige, M.; Löffler, M.; Geidel, M.; Albert, M.; Bartha, J.W.; Zschech, E.; van Dorp, Willem F.: Area-selective Atomic Layer Deposition of Ruthenium upon Focused Electron Beam Induced Deposition Platinum patterns versus Silicon Dioxide substrate. In: Area Selective Deposition workshop "ASD 2016" : April 15th, 2016, at imec in Leuven, Belgium. Leuven, 2016 (2016)

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Martin Knaut
Last modified: Oct 05, 2022