Veröffentlichte Konferenzbeiträge 61 bis 70 von 171 EinträgenBartha, J.W.; Albert, M.; Junige, M.; Knaut, M.: Automated ALD precursor qualification. In: Semicon Europa 2013 : TechArena. Emerging Research Materials. Dresden, 08.10.-10.10.2013 Vortrag (2013)Strobel, C.; Merkel, U.; Leszczynska, B.; Leszczynski, S.; Kuske, J.; Albert, M.; Bartha, J.W.: Very high deposition rate µc-Si:H absorber layer deposition using a plasma excitation frequency of 140 MHz in combination with high process pressures. In: Proceedings of 28th European Photovoltaic Solar Energy Conference and Exhibition, Paris, Frankreich, 30.09.-04.10.2013 (2013), S. 2573–2579Knaut, M.; Benner, F.; Hoßbach, C.; Geidel, M.; Dirnstorfer, I.; Albert, M.; Bartha, J.W.: In-situ Growth Control für AlxTiyOz Films and Laminates. In: 13th AVS conference on Atomic Layer Deposition, San Diego, CA, USA, 28.07.-31.07.2013 (2013)Shimizu, H.; Woijcik, H.; Shima, K.; Kobayashi, Y.; Momose, T.; Bartha, J. W.; Shimogaki, Y.: Comparative study on ALD/CVD-Co(W) films as a single barrier/liner layer for 22−1x nm generation interconnects . In: Interconnect Technology Conference (IITC), 2012 IEEE International, San Jose, CA, 4-6 June 2012 (2012), S. 1–3Thrun, X.; Choj, K.-H.; Freitag, M.; Grenville, A.; Gutsch, M.; Hohle, C.; Stowers, J. K.; Bartha, J. W.: Demonstration of 22nm SRAM features with patternable hafnium oxide-based resist material using electron-beam lithography. In: Proc. SPIE 8325, Advances in Resist Materials and Processing Technology XXIX, 832518 (19 March 2012), San Jose, California, USA, February 2012 (2012)He, J.; Howitz, S.; Killge, S.; Richter, K.; Bartha, J. W.: Deformations of soft imprint templates in the nanoimprint lithography. In: Proc. SPIE 8323, Alternative Lithographic Technologies IV, 83231B (March 1, 2012), Alternative Lithographic Technologies IV, San Jose, California, February 12, 2012 (2012)Benner, F.; Jordan, Pa. M.; Knaut, M.; Dirnstorfer, D.; Bartha, J.W.; Mikolajick, T.: Investigation of the c-Si/Al2O2 Interface for Silicon Surface Passivation. In: Proc. of the 27th European Photovoltaic Solar Energy Conferencse, Frankfurt (2012), S. 1793–1796Leszczynska, B.; Strobel, C.; Leszczynski, S.; Albert, M.; Bartha, J.W.; Stephan, U.; Kuske, J.: High-rate deposition of silicon thin film layers using linear plasma sources operated at very high excitation frequencies (80-140 MHz). In: Proceedings of SPIE Optics + Photonics Conference, Thin Film Solar Technology IV, vol. 8470 (2012) (2012)Künzelmann, K.; Müller, M. R.; Kallis, K.; Schütte, F.; Menzel, S.; Engels, S.; Fong, J.; Lin, C.; Dysard, J.; Bartha, J. W.; Knoch, J.: Chemical-Mechanical Planarization of Aluminium Damascene Structures. In: ICPT 2012 International Conference on Planarization/CMP Technology, Grenoble, France, October 15-17 (2012)Ernst, D.; Schumann, F.; Nobis, C.; Zerna, T.; Wolter, K.-J.: Mikrokontaktierverfahren auf flexiblen Verdrahtungsträgern. In: Deutsche IMAPS-Konferenz, 11.-12. Oktober 2012, München (2012)Zurück 3 4 5 6 7 8 9 10 11 12 WeiterDiese Informationen werden vom Vorgängersystem FIS bereitgestellt.